參數(shù)資料
型號: XP1022-BD-000V
廠商: MIMIX BROADBAND INC
元件分類: 衰減器
英文描述: 17.0-25.0 GHz GaAs MMIC Power Amplifier
中文描述: 17000 MHz - 25000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝: ROHS COMPLIANT, DIE-11
文件頁數(shù): 5/9頁
文件大小: 249K
代理商: XP1022-BD-000V
1
2
3
4
5
8
10
9
6
7
11
RF In
Vg1
RF Out
Vg2
Vd1
Vd2
Vd3
Vg3
Det
Vdet
Ref
1.330
(0.052)
1
2
3
4
5
8
10
0.514
(0.020)
0.890
(0.035)
1.519
(0.060)
2.036
(0.080)
2.145
(0.084)
9
1.623
(0.064)
0.831
(0.033)
0.0
0.0
0.745
(0.029)
0.716
(0.028)
6
7
0.194
(0.008)
0.085
(0.003)
11
0.467
(0.018)
2.230
(0.088)
17.0-25.0 GHz GaAs MMIC
Power Amplifier
P1022-BD
Page 5 of 9
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 20MPA0773)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads (except Vd3) are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads (and Vd3) are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.839 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (RF Out)
Bond Pad #6 (Ref)
Bond Pad #7 (Vdet)
Bond Pad #8 (Det)
Bond Pad #9 (Vg3)
Bond Pad #10 (Vg2)
Bond Pad #11 (Vg1)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
February 2007 - Rev 05-Feb-07
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