參數(shù)資料
型號: XP1013
廠商: Mimix Broadband, Inc.
英文描述: 17.0-26.0 GHz GaAs MMIC Power Amplifier
中文描述: 17.0-26.0 GHz的砷化鎵單片功率放大器
文件頁數(shù): 4/7頁
文件大?。?/td> 1516K
代理商: XP1013
1
2
3
4
5
6
7
8
Vd1,2,3
RF In
RF Out
Vg1,2,3
1.145
(0.045)
1
2
3
4
5
6
7
8
1.207
(0.048)
1.539
(0.061)
2.405
(0.095)
1.478
(0.058)
2.550
(0.100)
0.808
(0.032)
0.431
(0.017)
0.0
0.0
0.549
(0.022)
0.490
(0.019)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
17.0-26.0 GHz GaAs MMIC
Power Amplifier
Page 4 of 7
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 20MPA0289)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.807 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (RF Out)
Bond Pad #6 (Vg3)
Bond Pad #7 (Vg2)
Bond Pad #8 (Vg1)
May 2005 - Rev 05-May-05
P1013
Vd1,2,3
RF In
Vg1,2,3
RF Out
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