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參數(shù)資料
| 型號： | XC3S1000-4FG900C |
| 廠商： | XILINX INC |
| 元件分類： | FPGA |
| 英文描述： | Spartan-3 FPGA Family : Complete Data Sheet |
| 中文描述： | FPGA, 192 CLBS, 50000 GATES, PBGA900 |
| 封裝： | FBGA-900 |
| 文件頁數(shù)： | 10/192頁 |
| 文件大?。?/td> | 1555K |
| 代理商： | XC3S1000-4FG900C |
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Spartan-3 1.2V FPGA Family: Functional Description
DS099-2 (v1.2) July 11, 2003
Advance Product Specification
www.xilinx.com
1-800-255-7778
3
R
According to
Figure 1
, the clock line OTCLK1 connects the
CK inputs of the upper registers on the output and
three-state paths. Similarly, OTCLK2 connects the CK
inputs for the lower registers on the output and three-state
paths. The upper and lower registers on the input path have
independent clock lines: ICLK1 and ICLK2.
The enable line OCE connects the CE inputs of the upper
and lower registers on the output path. Similarly, TCE con-
nects the CE inputs for the register pair on the three-state
path and ICE does the same for the register pair on the
input path.
The Set/Reset (SR) line entering the IOB is common to all
six registers, as is the Reverse (REV) line.
Each storage element supports numerous options in addi-
tion to the control over signal polarity described in the IOB
Overview section. These are described in
Table 2
.
Double-Data-Rate Transmission
Double-Data-Rate (DDR) transmission describes the tech-
nique of synchronizing signals to both the rising and falling
edges of the clock signal. Spartan-3 devices use regis-
ter-pairs in all three IOB paths to perform DDR operations.
The pair of storage elements on the IOB’s Output path
(OFF1 and OFF2), used as registers, combine with a spe-
cial multiplexer to form a DDR D-type flip-flop (FDDR). This
primitive permits DDR transmission where output data bits
are synchronized to both the rising and falling edges of a
clock. It is possible to access this function by placing either
an FDDRRSE or an FDDRCPE component or symbol into
the design. DDR operation requires two clock signals (50%
duty cycle), one the inverted form of the other. These sig-
nals trigger the two registers in alternating fashion, as
shown in
Figure 2
. Commonly, the Digital Clock Manager
(DCM) generates the two clock signals by mirroring an
incoming signal, then shifting it 180 degrees. This approach
ensures minimal skew between the two signals.
The storage-element-pair on the Three-State path (TFF1
and TFF2) can also be combined with a local multiplexer to
form an FDDR primitive. This permits synchronizing the out-
put enable to both the rising and falling edges of a clock.
This DDR operation is realized in the same way as for the
output path.
The storage-element-pair on the input path (IFF1 and IFF2)
allows an I/O to receive a DDR signal. An incoming DDR
clock signal triggers one register and the inverted clock sig-
nal triggers the other register. In this way, the registers take
turns capturing bits of the incoming DDR data signal.
Aside from high bandwidth data transfers, DDR can also be
used to reproduce, or “mirror”, a clock signal on the output.
This approach is used to transmit clock and data signals
together. A similar approach is used to reproduce a clock
signal at multiple outputs. The advantage for both
approaches is that skew across the outputs will be minimal.
Table 2:
Storage Element Options
Option Switch
Function
Specificity
FF/Latch
Chooses between an edge-sensitive flip-flop or
a level-sensitive latch
Independent for each storage element.
SYNC/ASYNC
Determines whether SR is synchronous or
asynchronous
Independent for each storage element.
SRHIGH/SRLOW
Determines whether SR acts as a Set, which
forces the storage element to a logic “1"
(SRHIGH) or a Reset, which forces a logic “0”
(SRLOW).
Independent for each storage element, except
when using FDDR. In the latter case, the selection
for the upper element (OFF1 or TFF2) will apply to
both elements.
INIT1/INIT0
In the event of a Global Set/Reset, after
configuration or upon activation of the GTS net,
this switch decides whether to set or reset a
storage element. By default, choosing SRLOW
also selects INIT0; choosing SRHIGH also
selects INIT1.
Independent for each storage element, except
when using FDDR. In the latter case, selecting
INIT0 for one element applies to both elements
(even though INIT1 is selected for the other).
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| XC3S1000-4FG900I | Spartan-3 FPGA Family : Complete Data Sheet |
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| XC3S1000-4TQ144C | Spartan-3 FPGA Family: Complete Data Sheet |
| XC3S1000 | Spartan-3 FPGA Family: Complete Data Sheet |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| XC3S1000-4FG900I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-3 FPGA |
| XC3S1000-4FGG320C | 功能描述:SPARTAN-3A FPGA 1M STD 320-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC3S1000-4FGG320I | 功能描述:IC SPARTAN-3A FPGA 1M 320-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC3S1000-4FGG456C | 功能描述:IC SPARTAN-3 FPGA 1M 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3 標準包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA（23x23） 其它名稱:220-1241 |
| XC3S1000-4FGG456C4124 | 制造商:Xilinx 功能描述: |
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