參數(shù)資料
型號: XC2S150-5PQ208I
廠商: Xilinx Inc
文件頁數(shù): 69/99頁
文件大?。?/td> 0K
描述: IC FPGA 2.5V I-TEMP 208-PQFP
標(biāo)準(zhǔn)包裝: 24
系列: Spartan®-II
LAB/CLB數(shù): 864
邏輯元件/單元數(shù): 3888
RAM 位總計: 49152
輸入/輸出數(shù): 140
門數(shù): 150000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
Spartan-II FPGA Family: Pinout Tables
DS001-4 (v2.8) June 13, 2008
Module 4 of 4
Product Specification
71
R
Package Thermal Characteristics
Table 39 provides the thermal characteristics for the various
Spartan-II FPGA package offerings. This information is also
available using the Thermal Query tool on xilinx.com
The junction-to-case thermal resistance (
θJC) indicates the
difference between the temperature measured on the
package body (case) and the die junction temperature per
watt of power consumption. The junction-to-board (
θJB)
value similarly reports the difference between the board and
junction temperature. The junction-to-ambient (
θJA) value
reports the temperature difference between the ambient
environment and the junction temperature. The
θJA value is
reported at different air velocities, measured in linear feet
per minute (LFM). The “Still Air (0 LFM)” column shows the
θJA value in a system without a fan. The thermal resistance
drops with increasing air flow.
Table 39: Spartan-II Package Thermal Characteristics
Package
Device
Junction-to-Case
(
θJC)
Junction-to-
Board (
θJB)
Junction-to-Ambient (
θJA)
at Different Air Flows
Units
Still Air
(0 LFM)
250 LFM
500 LFM
750 LFM
VQ100
VQG100
XC2S15
11.3
N/A
44.1
36.7
34.2
33.3
°C/Watt
XC2S30
10.1
N/A
40.7
33.9
31.5
30.8
°C/Watt
TQ144
TQG144
XC2S15
7.3
N/A
38.6
30.0
25.7
24.1
°C/Watt
XC2S30
6.7
N/A
34.7
27.0
23.1
21.7
°C/Watt
XC2S50
5.8
N/A
32.2
25.1
21.4
20.1
°C/Watt
XC2S100
5.3
N/A
31.4
24.4
20.9
19.6
°C/Watt
CS144
CSG144
XC2S30
2.8
N/A
34.0
26.0
23.9
23.2
°C/Watt
PQ208
PQG208
XC2S50
6.7
N/A
25.2
18.6
16.4
15.2
°C/Watt
XC2S100
5.9
N/A
24.6
18.1
16.0
14.9
°C/Watt
XC2S150
5.0
N/A
23.8
17.6
15.6
14.4
°C/Watt
XC2S200
4.1
N/A
23.0
17.0
15.0
13.9
°C/Watt
FG256
FGG256
XC2S50
7.1
17.6
27.2
21.4
20.3
19.8
°C/Watt
XC2S100
5.8
15.1
25.1
19.5
18.3
17.8
°C/Watt
XC2S150
4.6
12.7
23.0
17.6
16.3
15.8
°C/Watt
XC2S200
3.5
10.7
21.4
16.1
14.7
14.2
°C/Watt
FG456
FGG456
XC2S150
2.0
N/A
21.9
17.3
15.8
15.2
°C/Watt
XC2S200
2.0
N/A
21.0
16.6
15.1
14.5
°C/Watt
相關(guān)PDF資料
PDF描述
HMM44DSAI CONN EDGECARD 88POS R/A .156 SLD
AMC28DRYI-S93 CONN EDGECARD 56POS DIP .100 SLD
XC3S400A-5FGG320C IC SPARTAN-3A FPGA 400K 320FBGA
XC3S400A-5FG320C IC SPARTAN-3A FPGA 400K 320FBGA
EHHD15MMB CONN DSUB 15PIN MALE-MALE BLK
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S150-5PQ208Q 制造商:Xilinx 功能描述:XC2S150-5PQ208Q - Trays 制造商:Xilinx 功能描述:Xilinx XC2S150-5PQ208Q FPGA
XC2S150-5PQG208C 功能描述:IC SPARTAN-II FPGA 150K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱:220-1241
XC2S150-5PQG208I 制造商:Xilinx 功能描述:FPGA SPARTAN-II 150K GATES 3888 CELLS 263MHZ 2.5V 208PQFP - Trays
XC2S150-5TQ144C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-II FPGA Family
XC2S150-5TQ144I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-II FPGA Family