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      參數(shù)資料
      型號: XA6SLX25T-3CSG324Q
      廠商: Xilinx Inc
      文件頁數(shù): 7/10頁
      文件大?。?/td> 0K
      描述: IC FPGA SPARTAN 6 324CSGBGA
      標準包裝: 126
      系列: Spartan®-6 LXT XA
      LAB/CLB數(shù): 1879
      邏輯元件/單元數(shù): 24051
      RAM 位總計: 958464
      輸入/輸出數(shù): 190
      電源電壓: 1.14 V ~ 1.26 V
      安裝類型: 表面貼裝
      工作溫度: -40°C ~ 125°C
      封裝/外殼: 324-LFBGA,CSPBGA
      供應商設備封裝: 324-CSPBGA
      XA Spartan-6 Automotive FPGA Family Overview
      DS170 (v1.3) December 13, 2012
      Product Specification
      6
      speed and efficiency of many applications, even beyond digital signal processing, such as wide dynamic bus shifters,
      memory address generators, wide bus multiplexers, and memory-mapped I/O register files. The accumulator can also be
      used as a synchronous up/down counter. The multiplier can perform barrel shifting.
      Input/Output
      The number of I/O pins varies from 132 to 328, depending on device and package size. Each I/O pin is configurable and can
      comply with a large number of standards, using up to 3.3V. The Spartan-6 FPGA SelectIO Resources User Guide describes
      the I/O compatibilities of the various I/O options. With the exception of supply pins and a few dedicated configuration pins,
      all other package pins have the same I/O capabilities, constrained only by certain banking rules. All user I/O is bidirectional;
      there are no input-only pins.
      All I/O pins are organized in four banks. Each bank has several common VCCO output supply-voltage pins, which also
      powers certain input buffers. Some single-ended input buffers require an externally applied reference voltage (VREF). There
      are several dual-purpose VREF-I/O pins in each bank. In a given bank, when I/O standard calls for a VREF voltage, each VREF
      pin in that bank must be connected to the same voltage rail and can not be used as an I/O pin.
      I/O Electrical Characteristics
      Single-ended outputs use a conventional CMOS push/pull output structure, driving High towards VCCO or Low towards
      ground, and can be put into high-Z state. Many I/O features are available to the system designer to optionally invoke in each
      I/O in their design, such as weak internal pull-up and pull-down resistors, strong internal split-termination input resistors,
      adjustable output drive-strengths and slew-rates, and differential termination resistors. See the Spartan-6 FPGA SelectIO
      Resources User Guide for more details on available options for each I/O standard.
      I/O Logic
      Input and Output Delay
      This section describes the available logic resources connected to the I/O interfaces. All inputs and outputs can be configured
      as either combinatorial or registered. Double data rate (DDR) is supported by all inputs and outputs. Any input or output can
      be individually delayed by up to 256 increments. This is implemented as IODELAY2. The identical delay value is available
      either for data input or output. For a bidirectional data line, the transfer from input to output delay is automatic. The number
      of delay steps can be set by configuration and can also be incremented or decremented while in use.
      Because these tap delays vary with supply voltage, process, and temperature, an optional calibration mechanism is built into
      each IODELAY2:
      For source synchronous designs where more accuracy is required, the calibration mechanism can (optionally)
      determine dynamically how many taps are needed to delay data by one full I/O clock cycle, and then programs the
      IODELAY2 with 50% of that value, thus centering the I/O clock in the middle of the data eye.
      A special mode is available only for differential inputs, which uses a phase-detector mechanism to determine whether
      the incoming data signal is being accurately sampled in the middle of the eye. The results from the phase-detector logic
      can be used to either increment or decrement the input delay, one tap at a time, to ensure error-free operation at very
      high bit rates.
      ISERDES and OSERDES
      Many applications combine high-speed bit-serial I/O with slower parallel operation inside the device. This requires a
      serializer and deserializer (SerDes) inside the I/O structure. Each input has access to its own deserializer (serial-to-parallel
      converter) with programmable parallel width of 2, 3, or 4 bits. Where differential inputs are used, the two serializers can be
      cascaded to provide parallel widths of 5, 6, 7, or 8 bits. Each output has access to its own serializer (parallel-to-serial
      converter) with programmable parallel width of 2, 3, or 4 bits. Two serializers can be cascaded when a differential driver is
      used to give access to bus widths of 5, 6, 7, or 8 bits.
      When distributing a double data rate clock, all SerDes data is actually clocked in/out at single data rate to eliminate the
      possibility of bit errors due to duty cycle distortion. This faster single data rate clock is either derived via frequency
      multiplication in a PLL, or doubled locally in each IOB by differentiating both clock edges when the incoming clock uses
      double data rate.
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