參數(shù)資料
型號: XA3S250E-4PQG208I
廠商: Xilinx Inc
文件頁數(shù): 6/37頁
文件大?。?/td> 0K
描述: IC FPGA SPARTAN-3E 250K 208-PQFP
標準包裝: 24
系列: Spartan®-3E XA
LAB/CLB數(shù): 612
邏輯元件/單元數(shù): 5508
RAM 位總計: 221184
輸入/輸出數(shù): 158
門數(shù): 250000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 208-BFQFP
供應商設備封裝: 208-PQFP(28x28)
DS635 (v2.0) September 9, 2009
Product Specification
14
R
Switching Characteristics
I/O Timing
Figure 5: External Termination Resistors for BLVDS Transmitter and BLVDS Receiver
Z0 = 50
Ω
Z0 = 50
Ω
140
Ω
165
Ω
165
Ω
100
Ω
DS635_05_082807
VCCO = 2.5V
1/4th of Bourns
Part Number
CAT16-LV4F12
VCCO = 2.5V
1/4th of Bourns
Part Number
CAT16-PT4F4
Table 13: Pin-to-Pin Clock-to-Output Times for the IOB Output Path
Symbol
Description
Conditions
Device
-4 Speed
Grade
Units
Max
Clock-to-Output Times
TICKOFDCM
When reading from the Output
Flip-Flop (OFF), the time from
the active transition on the
Global Clock pin to data
appearing at the Output pin. The
DCM is used.
LVCMOS25(2), 12mA
output drive, Fast slew rate,
with DCM(3)
XA3S100E
2.79
ns
XA3S250E
3.45
ns
XA3S500E
3.46
ns
XA3S1200E
3.46
ns
XA3S1600E
3.45
ns
TICKOF
When reading from OFF, the
time from the active transition on
the Global Clock pin to data
appearing at the Output pin. The
DCM is not used.
LVCMOS25(2), 12mA
output drive, Fast slew rate,
without DCM
XA3S100E
5.92
ns
XA3S250E
5.43
ns
XA3S500E
5.51
ns
XA3S1200E
5.94
ns
XA3S1600E
6.05
ns
Notes:
1.
The numbers in this table are tested using the methodology presented in Table 19 and are based on the operating conditions set forth in
2.
This clock-to-output time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or a
standard other than LVCMOS25 with 12 mA drive and Fast slew rate is assigned to the data Output. If the former is true, add the appropriate
Input adjustment from Table 17. If the latter is true, add the appropriate Output adjustment from Table 18.
3.
DCM output jitter is included in all measurements.
4.
For minimums, use the values reported by the Xilinx timing analyzer.
相關PDF資料
PDF描述
XA3S400-4PQG208I IC FPGA SPARTAN-3 400K 208-PQFP
XC3S250E-4FT256I IC FPGA SPARTAN 3E 256FTBGA
93LC76BT-I/ST IC EEPROM 8KBIT 512X16 8-TSSOP
93LC76BT-I/MS IC EEPROM 8KBIT 512X16 8-MSOP
93LC76B-I/ST IC EEPROM 8KBIT 512X16 8-TSSOP
相關代理商/技術參數(shù)
參數(shù)描述
XA3S250E-4PQG208Q 功能描述:IC FPGA SPARTAN-3E 250K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XA3S250E-4TQG144I 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XA3S250E-4TQG144Q 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XA3S250E-4VQG100I 功能描述:IC FPGA SPARTAN-3E 250K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XA3S250E-4VQG100Q 功能描述:IC FPGA SPARTAN-3E 250K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)