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參數(shù)資料
| 型號(hào)： | XA3S200-4FTG256I |
| 廠商： | Xilinx Inc |
| 文件頁(yè)數(shù)： | 2/8頁(yè) |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-3 200K 256-FTBGA |
| 標(biāo)準(zhǔn)包裝： | 90 |
| 系列： | Spartan®-3 XA |
| LAB/CLB數(shù)： | 480 |
| 邏輯元件/單元數(shù)： | 4320 |
| RAM 位總計(jì)： | 221184 |
| 輸入/輸出數(shù)： | 173 |
| 門數(shù)： | 200000 |
| 電源電壓： | 1.14 V ~ 1.26 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 100°C |
| 封裝/外殼： | 256-LBGA |
| 供應(yīng)商設(shè)備封裝： | 256-FTBGA |
Introduction and Ordering Information
DS314 (v1.3) June 18, 2009
Product Specification
2
R
Fast look-ahead carry logic
Dedicated 18 x 18 multipliers
JTAG logic compatible with IEEE 1149.1/1532
SelectRAM hierarchical memory
Up to 576 Kbits of total block RAM
Up to 208 Kbits of total distributed RAM
Digital Clock Manager (up to four DCMs)
Clock skew elimination
Frequency synthesis
High-resolution phase shifting
Maximum clock frequency 125 MHz
Fully supported by Xilinx ISE software development
system
Synthesis, mapping, placement and routing
MicroBlaze processor, CAN, LIN, MOST, and other
cores
Pb-free packaging options
Xilinx and all of our production partners are qualified to
ISO-TS16949
Please refer to the Spartan-3 complete data sheet (DS099)
for a full product description, AC and DC specifications, and
package pinout descriptions
Architectural Overview
The Spartan-3 family architecture consists of five
fundamental programmable functional elements:
Configurable Logic Blocks (CLBs) contain RAM-based
Look-Up Tables (LUTs) to implement logic and storage
elements that can be used as flip-flops or latches.
CLBs can be programmed to perform a wide variety of
logical functions as well as to store data.
Input/Output Blocks (IOBs) control the flow of data
between the I/O pins and the internal logic of the
device. Each IOB supports bidirectional data flow plus
3-state operation. Twenty-six different signal standards,
including eight high-performance differential standards,
are available as shown in Table 2. Double Data-Rate
(DDR) registers are included. The Digitally Controlled
Impedance (DCI) feature provides automatic on-chip
terminations, simplifying board designs.
Block RAM provides data storage in the form of 18-Kbit
dual-port blocks.
Multiplier blocks accept two 18-bit binary numbers as
inputs and calculate the product.
Digital Clock Manager (DCM) blocks provide
self-calibrating, fully digital solutions for distributing,
delaying, multiplying, dividing, and phase shifting clock
signals.
These elements are organized as shown in Figure 1. A ring
of IOBs surrounds a regular array of CLBs. The XA3S50
has a single column of block RAM embedded in the array.
Those devices ranging from the XA3S200 to the XA3S1500
have two columns of block RAM. Each column is made up
of several 18 Kbit RAM blocks; each block is associated
with a dedicated multiplier. The DCMs are positioned at the
ends of the block RAM columns.
The Spartan-3 family features a rich network of traces and
switches that interconnect all five functional elements,
transmitting signals among them. Each functional element
has an associated switch matrix that permits multiple
connections to the routing.
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| XA3S200-4FTG256Q | 功能描述:IC FPGA SPARTAN-3 200K 256-FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XA3S200-4PQG208I | 功能描述:IC FPGA SPARTAN-3 200K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XA3S200-4PQG208Q | 功能描述:IC FPGA SPARTAN-3 200K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XA3S200-4TQG144I | 功能描述:IC FPGA SPARTAN-3 200K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XA3S200-4TQG144Q | 功能描述:IC FPGA SPARTAN-3 200K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
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