參數(shù)資料
型號(hào): XA3S1200E-4FGG400I
廠商: Xilinx Inc
文件頁(yè)數(shù): 6/37頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SPARTAN-3E 1200K 400-FBG
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®-3E XA
LAB/CLB數(shù): 8672
邏輯元件/單元數(shù): 19512
RAM 位總計(jì): 516096
輸入/輸出數(shù): 304
門數(shù): 1200000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 400-BGA
供應(yīng)商設(shè)備封裝: 400-FBGA(21x21)
DS635 (v2.0) September 9, 2009
Product Specification
14
R
Switching Characteristics
I/O Timing
Figure 5: External Termination Resistors for BLVDS Transmitter and BLVDS Receiver
Z0 = 50
Ω
Z0 = 50
Ω
140
Ω
165
Ω
165
Ω
100
Ω
DS635_05_082807
VCCO = 2.5V
1/4th of Bourns
Part Number
CAT16-LV4F12
VCCO = 2.5V
1/4th of Bourns
Part Number
CAT16-PT4F4
Table 13: Pin-to-Pin Clock-to-Output Times for the IOB Output Path
Symbol
Description
Conditions
Device
-4 Speed
Grade
Units
Max
Clock-to-Output Times
TICKOFDCM
When reading from the Output
Flip-Flop (OFF), the time from
the active transition on the
Global Clock pin to data
appearing at the Output pin. The
DCM is used.
LVCMOS25(2), 12mA
output drive, Fast slew rate,
with DCM(3)
XA3S100E
2.79
ns
XA3S250E
3.45
ns
XA3S500E
3.46
ns
XA3S1200E
3.46
ns
XA3S1600E
3.45
ns
TICKOF
When reading from OFF, the
time from the active transition on
the Global Clock pin to data
appearing at the Output pin. The
DCM is not used.
LVCMOS25(2), 12mA
output drive, Fast slew rate,
without DCM
XA3S100E
5.92
ns
XA3S250E
5.43
ns
XA3S500E
5.51
ns
XA3S1200E
5.94
ns
XA3S1600E
6.05
ns
Notes:
1.
The numbers in this table are tested using the methodology presented in Table 19 and are based on the operating conditions set forth in
2.
This clock-to-output time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or a
standard other than LVCMOS25 with 12 mA drive and Fast slew rate is assigned to the data Output. If the former is true, add the appropriate
Input adjustment from Table 17. If the latter is true, add the appropriate Output adjustment from Table 18.
3.
DCM output jitter is included in all measurements.
4.
For minimums, use the values reported by the Xilinx timing analyzer.
相關(guān)PDF資料
PDF描述
93C86BT-E/ST IC EEPROM 16KBIT 1024X16 8-TSSOP
93C86BT-E/MS IC EEPROM 16KBIT 1024X16 8-MSOP
93C86B-E/ST IC EEPROM 16KBIT 1024X16 8-TSSOP
93C86B-E/MS IC EEPROM 16KBIT 1024X16 8-MSOP
XC3SD3400A-4CS484C SPARTAN-3ADSP FPGA 3400K 484CSA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XA3S1200E-4FGG400Q 功能描述:IC FPGA SPARTAN-3E 1200K 400-FBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1200E-4FTG256I 功能描述:IC FPGA SPARTAN3E 1200K 256FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1200E-4FTG256Q 功能描述:IC FPGA SPARTAN3E 1200K 256FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1400A 制造商:XILINX 制造商全稱:XILINX 功能描述:XA Spartan-3A Automotive FPGA Family Data Sheet
XA3S1400A-4FGG484I 功能描述:IC FPGA SPARTAN3A 1400K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-3A XA 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5