參數(shù)資料
型號: XA3S100E-4VQG100Q
廠商: Xilinx Inc
文件頁數(shù): 22/37頁
文件大小: 0K
描述: IC FPGA SPARTAN-3E 100K 100-VQFP
標(biāo)準(zhǔn)包裝: 90
系列: Spartan®-3E XA
LAB/CLB數(shù): 240
邏輯元件/單元數(shù): 2160
RAM 位總計: 73728
輸入/輸出數(shù): 66
門數(shù): 100000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 100-TQFP
供應(yīng)商設(shè)備封裝: 100-VQFP(14x14)
DS635 (v2.0) September 9, 2009
Product Specification
29
R
Configuration and JTAG Timing
Table 33: Power-On Timing and the Beginning of Configuration
Symbol
Description
Device
-4 Speed Grade
Units
Min
Max
TPOR(2)
The time from the application of VCCINT, VCCAUX, and VCCO
Bank 2 supply voltage ramps (whichever occurs last) to the
rising transition of the INIT_B pin
XA3S100E
-
5
ms
XA3S250E
-
5
ms
XA3S500E
-
5
ms
XA3S1200E
-
5
ms
XA3S1600E
-
7
ms
TPROG
The width of the low-going pulse on the PROG_B pin
All
0.5
-
μs
TPL(2)
The time from the rising edge of the PROG_B pin to the
rising transition on the INIT_B pin
XA3S100E
-0.5
ms
XA3S250E
-0.5
ms
XA3S500E
-1
ms
XA3S1200E
-2
ms
XA3S1600E
-2
ms
TINIT
Minimum Low pulse width on INIT_B output
All
250
-ns
TICCK(3)
The time from the rising edge of the INIT_B pin to the
generation of the configuration clock signal at the CCLK
output pin
All
0.5
4.0
μs
Notes:
1.
The numbers in this table are based on the operating conditions set forth in Table 6. This means power must be applied to all VCCINT, VCCO,
and VCCAUX lines.
2.
Power-on reset and the clearing of configuration memory occurs during this period.
3.
This specification applies only to the Master Serial, SPI, BPI-Up, and BPI-Down modes.
相關(guān)PDF資料
PDF描述
XC6SLX4-L1CPG196I IC FPGA SPARTAN 6 3K 196CPGBGA
XC3S200-4TQ144I IC FPGA SPARTAN 3 144TQFP
XC3S200-5TQG144C SPARTAN-3A FPGA 200K 144-TQFP
XC2S50E-6TQG144C IC SPARTAN-IIE FPGA 50K 144-TQFP
XC2S50E-6TQ144C IC FPGA 1.8V 384 CLB'S 144-TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XA3S1200E-4FGG400I 功能描述:IC FPGA SPARTAN-3E 1200K 400-FBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1200E-4FGG400Q 功能描述:IC FPGA SPARTAN-3E 1200K 400-FBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1200E-4FTG256I 功能描述:IC FPGA SPARTAN3E 1200K 256FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1200E-4FTG256Q 功能描述:IC FPGA SPARTAN3E 1200K 256FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1400A 制造商:XILINX 制造商全稱:XILINX 功能描述:XA Spartan-3A Automotive FPGA Family Data Sheet