參數資料
型號: X28C64TMB-25
英文描述: 5 Volt, Byte Alterable E2PROM
中文描述: 5伏,可變E2PROM的字節(jié)
文件頁數: 24/25頁
文件大?。?/td> 110K
代理商: X28C64TMB-25
24
X28C64
PACKAGING INFORMATION
3926 ILL F38.1
8.02 (0.315)
7.98 (0.314)
1.18 (0.046)
1.02 (0.040)
0.17 (0.007)
0.03 (0.001)
0.26 (0.010)
0.14 (0.006)
0.50 (0.0197) BSC
0.58 (0.023)
0.42 (0.017)
14.15 (0.557)
13.83 (0.544)
12.50 (0.492)
12.30 (0.484)
PIN #1 IDENT.
O 0.76 (0.03)
SEATING
PLANE
SEE NOTE 2
SEE NOTE 2
0.50 ± 0.04
(0.0197 ± 0.0016)
0.30 ± 0.05
(0.012 ± 0.002)
TYPICAL
32 PLACES
14.80 ± 0.05
(0.583 ± 0.002)
1.30 ± 0.05
(0.051 ± 0.002)
0.17 (0.007)
0.03 (0.001)
15 EQ. SPC. 0.50 ± 0.04
0.0197 ± 0.016 = 7.50 ± 0.06
(0.295 ± 0.0024) OVERALL
TOL. NON-CUMULATIVE
SOLDER PADS
FOOTPRINT
NOTE:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES IN PARENTHESES).
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) TYPE T
相關PDF資料
PDF描述
X28C64DM-15 5 Volt, Byte Alterable E2PROM
X28C64DM-20 5 Volt, Byte Alterable E2PROM
X28C64DM-25 5 Volt, Byte Alterable E2PROM
X28C64FM-15 5 Volt, Byte Alterable E2PROM
X28C64EI-15 5 Volt, Byte Alterable E2PROM
相關代理商/技術參數
參數描述
X28F00AH33EF95C 制造商:Micron Technology Inc 功能描述:X28F00AH33EF95C - Trays
X28F024M180F96C 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film
X28F024M181F96C 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film
X28F128M180F96C 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film
X28F128M181F96C 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film