參數(shù)資料
型號: WSF128K16-37HCA
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: 存儲器
英文描述: SPECIALTY MEMORY CIRCUIT, CPGA66
封裝: 1.185 X 1.185 INCH, CERAMIC, HIP-66
文件頁數(shù): 8/16頁
文件大小: 686K
代理商: WSF128K16-37HCA
16
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WSF128K16-XXX
May 2003
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400)
H = 1.185" sq. Ceramic Hex In-line Package, HIP (Package 401)
G1U = 22.4 mm Ceramic Quad Flat Pack, CQFP (Package 519)
G1T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 524)
ACCESS TIME (ns)
37 = 35ns SRAM and 70ns FLASH
72 = 70ns SRAM and 120ns FLASH
ORGANIZATION, 128K x 16
FLASH
SRAM
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W S F 128K16 - XXX X X X
DEVICE TYPE
SRAM SPEED
FLASH SPEED
PACKAGE
SMD NO.
128K x 16 Mixed Module
70ns
120ns
66 pin HIP (H)
5962-96900 01HXX
128K x 16 Mixed Module
70ns
120ns
66 pin HIP (H1)
5962-96900 01HYX
128K x 16 Mixed Module
70ns
120ns
68 lead CQFP/J (G1U)
5962-96900 01H9X
128K x 16 Mixed Module
35ns
70ns
66 pin HIP (H)
5962-96900 02HXX
128K x 16 Mixed Module
35ns
70ns
66 pin HIP (H1)
5962-96900 02HYX
128K x 16 Mixed Module
35ns
70ns
68 lead CQFP/J (G1U)
5962-96900 02H9X
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