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參數(shù)資料
| 型號(hào)： | WPC-2012-10JT |
| 元件分類(lèi)： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.01 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 2012, ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 2/10頁(yè) |
| 文件大小： | 365K |
| 代理商： | WPC-2012-10JT |
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380
www.worldproducts.com
050505 Rev. 13.0
9
CHIP CERAMIC INDUCTORS
Soldering Profile
REFLOW SOLDERING(Peak 230°C)
REFLOW SOLDERING (Peak 250°C)
FLOW SOLDERING
MANUAL SOLDERING
Precaution for Storage
Electrical characteristics of product will not change when stored under typical environmental conditions. However, it is possible that the
solderability of terminal electrodes and the characteristics of the tape packaging can change during storage. For this reason, the following
storage guidelines should be followed.
1.
Storage Environment: The tape packaging material is designed to withstand long-term storage but they will degrade more rapidly in
the presence of high temperature or high humidity. Therefore, product shall be stored in an ambient temperature of less than 40°C
with a relative humidity of less than 70%. The products should be used within 6 months of receipt. To achieve best solderability,
product should be used as soon as possible after unpacking. Leftover product must be stored in dry condition with desiccant.
2.
Corrosive gases: Since sulfur and chlorine may degrade the solderability of the terminal electrodes, it is important to store the product
in an environment free of such gases.
3.
Temperature fluctuations: Dew condensation may occur when the product is taken out of storage due to variation of temperature. It is
important to maintain a temperature-controlled environment.
DISCLAIMER: The names of the products and the specifications in this catalog are subject to change without notice for the sake of improvement. World Products Inc. also reserves the right to
discontinue any of these products. The products in this catalog are intended for use in ordinary electronic products. If any of these products are to be used in special applications requiring
extremely high reliability, where product defects might pose a safety risk, please consult World Products Inc. Though World Products Inc. has taken all possible precautions to ensure the
quality and reliability of its products, improper use of products may result in bodily injury, fire, or similar accident. If you have any questions regarding the use of the products in question, please
consult World Products Inc. Please be advised that World Products Inc. accepts no responsibility for any infraction by users of World Products Inc. products on third party patents or industrial
copyrights.
300
200°C
230°C
150°C
0
50
100
150
200
250
60 sec. min.
20 sec. max.
Soldering
10 sec. max.
Cooling
60 sec. min.
250°C
220°C
190°C
150°C
0
50
100
150
200
250
300
350
100 sec. min.
60 sec. max.
Soldering
10 sec. max.
175°C
250°C
150°C
0
50
100
150
200
60 sec. min.
Dipping
10 sec. max.
Cooling
60 sec. min.
Preheating
100 sec. max.
T≤200°C/ .5 sec
300°C
Tc°C
soldering
2 sec max.
solder iron
30w max.
Diameter of
solder iron
1.2mm max.
T
180°C
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