- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄231494 > W3DG6418V10D2SG (MICROSEMI CORP-PMG MICROELECTRONICS) 16M X 64 SYNCHRONOUS DRAM MODULE, DMA168 PDF資料下載
參數(shù)資料
| 型號(hào)： | W3DG6418V10D2SG |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類(lèi)： | DRAM |
| 英文描述： | 16M X 64 SYNCHRONOUS DRAM MODULE, DMA168 |
| 封裝： | ROHS COMPLIANT, DIMM-168 |
| 文件頁(yè)數(shù)： | 4/7頁(yè) |
| 文件大?。?/td> | 143K |
| 代理商： | W3DG6418V10D2SG |
4
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3DG6418V-D2
March 2006
Rev. 1
PRELIMINARY
OPERATING CURRENT CHARACTERISTICS
VCC = 3.3V, 0°C ≤ TA ≤ 70°C
Parameters
Symbol
Conditions
Versions
Units
Note
133
100
Operating Current
(One bank active)
ICC1
Burst Length = 1
tRC ≥ tRC(min)
IOL = 0mA
720
mA
1
Precharge Standby Current
in Power Down Mode
ICC2P
CKE ≤ VIL(max), tCC = 10ns
16
mA
ICC2PS
CKE & CK ≤ VIL(max), tCC = ∞
16
mA
Precharge Standby Current
in Non-Power Down Mode
ICC2N
CKE ≥ VIH(min), CS ≥ VIH(min), tCC =10ns
Input signals are charged one time during 20
160
mA
ICC2NS
CKE ≥ VIH(min), CK ≤ VIL(max), tCC= ∞
Input signals are stable
80
mA
Active standby current in power-
down mode
ICC3P
CKE ≥ VIL(max), tCC = 10ns
40
mA
ICC3PS
CKE & CK ≤ VIL(max), tCC = ∞
40
Active standby in current non
power-down mode
ICC3N
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are charged one time during 20ns
240
mA
ICC3NS
CKE ≥ VIH(min), CK ≤ VIL(max), tCC = ∞
input signals are stable
200
mA
Operating current (Burst mode)
ICC4
Io = mA
Page burst
4 Banks activated
tCCD = 2CK
880
mA
1
Refresh current
ICC5
tRC ≥ tRC(min)
1600
mA
2
Self refresh current
ICC6
CKE ≤ 0.2V
16
mA
Notes:
1.
Measured with outputs open.
2.
Refresh period is 64ms.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W3EG2128M72AFSR265AD3MG | 256M X 72 DDR DRAM MODULE, 0.75 ns, DMA184 |
| W3EG72128S202D3S | 128M X 72 DDR DRAM MODULE, 0.75 ns, DMA184 |
| W3EG7232S265BD4-M | 32M X 72 DDR DRAM MODULE, 0.75 ns, DMA200 |
| W7NCF02GH10CSA9HM1G | FLASH 3.3V PROM MODULE, XMA50 |
| W7NCF02GH10IS5BM1G | FLASH 3.3V PROM MODULE, XMA50 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3DG6418V10D2XX | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:128MB - 16Mx64, SDRAM UNBUFFERED |
| W3DG6418V10JD1 | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:128MB - 16Mx64 SDRAM UNBUFFERED |
| W3DG6418V75AD1 | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:128MB - 16Mx64 SDRAM UNBUFFERED |
| W3DG6418V75D1 | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:128MB - 16Mx64 SDRAM UNBUFFERED |
| W3DG6418V75D2I-XX | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:128MB - 16Mx64, SDRAM UNBUFFERED |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。