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| 型號(hào)： | VSC7123QN |
| 廠商： | VITESSE SEMICONDUCTOR CORP |
| 元件分類(lèi)： | 網(wǎng)絡(luò)接口 |
| 英文描述： | 10-Bit Transceiver for Fibre Channel and Gigabit Ethernet |
| 中文描述： | DATACOM, ETHERNET TRANSCEIVER, PQFP64 |
| 封裝： | 14 X 14 MM, THERMALLY ENHANCED, PLASTIC, QFP-64 |
| 文件頁(yè)數(shù)： | 17/18頁(yè) |
| 文件大?。?/td> | 208K |
| 代理商： | VSC7123QN |
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V
ELOCITY
TM
VITESSE
VSC7123
10-Bit Transceiver for Fibre
Channel and Gigabit Ethernet
Data Sheet
G52212-0, Rev 4.3
03/25//01
Page 17
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano
Camarillo, CA 93012
Tel: (800) VITESSE
FAX: (805) 987-5896
Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Package Thermal Considerations
The VSC7123 is packaged in a 14mm, thermally-enhanced PQFP with an internal heat spreader a 10 mm,
thermally enhanced PQFP and a 10mm cavity-down, exposed pad TQFP. These packages use industry-standard
EIAJ footprints, but have been enhanced to improve thermal dissipation. The construction of the packages is
shown in Figure 10.
Figure 10: PQFP Package Cross Section
Table 6: Thermal Resistance
The VSC7123 is designed to operate with a case temperature up to 95
o
C. The user must guarantee that the
case temperature specification is not violated. With the thermal resistances shown in Table 7, the 10mm
thermally-enhanced PQFP package can operate in still air ambient temperatures of 50
o
C [50
o
C = 95
o
C - 0.9W *
50 C/W]. The 14mm thermally-enhanced PQFP package can operate in still air ambient temperatures of 69
o
C
[69
o
C = 95
o
C - 0.9W * 29 C/W]. The TQFP package can operate in a still air ambient temperature of 59
o
C
[59
o
C = 95
o
C - 0.9W * 40 C/W]. If the ambient air temperature exceeds these limits, a form of cooling through
a heatsink or an increase in airflow must be provided.
Moisture Sensitivity Level
This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30
o
C,
60% relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures.
Symbol
Description
10mm
PQFP
14mm
PQFP
10mm
TQFP
Units
θ
jc
θ
ca
Thermal resistance from junction-to-case
10
9.5
7.0
o
C/W
Thermal resistance from case-to-ambient in still air including
conduction through the leads.
50
29
40
o
θ
ca-100
θ
ca-200
θ
ca-400
θ
ca-600
Thermal resistance from case-to-ambient with 100 LFM airflow
41
26
38
o
C/W
o
C/W
o
C/W
o
C/W
Thermal resistance from case-to-ambient with 200 LFM airflow
37
24
35
Thermal resistance from case-to-ambient with 400 LFM airflow
32
21
33
Thermal resistance from case-to-ambient with 600 LFM airflow
28
18
30
Internal Heat Spreader
Die
Plastic Molding Compound
Lead
Bond Wire
Insulator
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