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參數(shù)資料
| 型號(hào)： | V23809-E1-E30 |
| 廠商： | SIEMENS A G |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, XFO51 |
| 封裝： | SMT-51 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 126K |
| 代理商： | V23809-E1-E30 |
V23809-E1-E30, 1300 nm ESCON
Parallel Transceiver
5
Semiconductor Group
APPLICATION NOTE
Power Supply Filtering
In most applications using the ESCON 200 MBd transceiver
additional high speed circuits, such as a switching power
supply, clock oscillator, or high speed multiplexer, are present
on the application board. These often create power supply noise
at a high spectral bandwidth, which is caused by very fast
transitions in today’s chip technology.
The Siemens ESCON transceiver provides superior EMI
performance immunity against conductive noise. Some basic
recommendations are given here to ensure proper functionality
in the field.
The use of a multilayer board with ground and V
CC
plane is
strongly recommended. The Vcc plane should be slotted to
avoid crosstalk between different circuitry inside the module.
The metallized package is internally connected to the V
EE
pins
of the module. Nevertheless, the package must be connected
externally to ground for best shielding characteristics. Ground
contact should be made with the ground rings shown in the
diagram below. Because of high switching currents at V
CC
DRI,
the use of an external 6.8
μ
F to 22
μ
F capacitor is recom-
mended at V
CC
DRI.
The observance of normal design rules for high speed digital
systems is sufficient to ensure safe operation.
Slotting of V
CC
Plane
Note
Slots are non-copper areas inside the V
CC
plane to avoid cross-
current flow.
V
CC
Plane
V
CC
CMOS
V
CC
BIP
V
CC
DRI
V
CC
PRE
Slots
1
Recommended Footprint
Avoid placing any component or non-isolated structure, like
tracks or vias, under the transceiver.
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