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參數(shù)資料
| 型號(hào)： | UPG2024TQ-E1-A |
| 廠商： | California Eastern Laboratories |
| 英文描述： | NECs GaAs MMIC DPDT SWITCHES FOR 5 GHz BAND WIRELESS LAN |
| 中文描述： | 鄰舍砷化鎵微波單片集成電路DPDT開(kāi)關(guān)的5 GHz頻帶無(wú)線局域網(wǎng) |
| 文件頁(yè)數(shù)： | 10/11頁(yè) |
| 文件大?。?/td> | 547K |
| 代理商： | UPG2024TQ-E1-A |
10
UPG2024TQ
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
SOLDERING METHOD
SOLDERING CONDITIONS
CONDITION SYMBOL
Infrared Reflow
Peak temperature (package surface temperature)
: 260
°
C or below
: 10 seconds or less
Time at peak temperature
Time at temperature of 220
°
C or higher
Preheating time at 120 to 180
°
C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 60 seconds or less
: 120
±
30 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120
°
C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 260
°
C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350
°
C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
05/04/2005
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