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參數(shù)資料
| 型號(hào)： | UPG2009TB |
| 廠商： | NEC Corp. |
| 英文描述： | NECs L, S-BAND 4W SPDT SWITCH |
| 中文描述： | 鄰舍升，S波段4瓦單刀雙擲開關(guān) |
| 文件頁數(shù)： | 8/8頁 |
| 文件大小： | 134K |
| 代理商： | UPG2009TB |
UPG2009TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales of
fi
ce.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Re
fl
ow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220
°
C or higher
Preheating time at 120 to 180
°
C
Maximum number of re
fl
ow processes
Maximum chlorine content of rosin
fl
ux (% mass)
: 260
°
C or below
: 10 seconds or less
: 60 seconds or less
: 120
±
30 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
Time at temperature of 200
°
C or higher
Preheating time at 120 to 150
°
C
Maximum number of re
fl
ow processes
Maximum chlorine content of rosin
fl
ux (% mass)
: 215
°
C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120
°
C or below
Maximum number of
fl
ow processes
Maximum chlorine content of rosin
fl
ux (% mass)
: 260
°
C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin
fl
ux (% mass)
: 350
°
C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
02/18/2004
Caution
Do not use different soldering methods together (except for partial heating).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPG2009TB_1 | 制造商:NEC 制造商全稱:NEC 功能描述:L-BAND HIGH POWER SPDT SWITCH |
| UPG2009TB-A | 功能描述:RF 開關(guān) IC L S Band SPDT Switch RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| UPG2009TBE3 | 制造商: 功能描述: 制造商:undefined 功能描述: |
| UPG2009TB-E3 | 功能描述:RF 開關(guān) IC L S Band SPDT Switch RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| UPG2009TB-E3-A | 功能描述:RF 開關(guān) IC L S Band SPDT Switch RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
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