參數(shù)資料
型號(hào)： UPD784021GK-BE9
廠商： NEC Corp.
英文描述： 16/8-BIT SINGLE-CHIP MICROCOMPUTER
中文描述： 16/8-BIT單片機(jī)
文件頁(yè)數(shù)： 82/90頁(yè)
文件大小： 614K
代理商： UPD784021GK-BE9
82
m
PD784020, 784021
16. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
m
PD784021.
For details of the recommended soldering conditions, refer to our document SMD Surface Mount Technology
Manual (C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 16-1 Soldering Conditions for Surface-Mount Devices
(1)
m
PD784020GC-3B9: 80-pin plastic QFP (14
￥
14 mm)
m
PD784021GC-3B9: 80-pin plastic QFP (14
￥
14 mm)
(2)
m
PD784021GK-BE9: 80-pin plastic TQFP (fine pitch) (12
￥
12 mm)
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25 C and maximum relative humidity at 65 % or less
Caution Do not apply more than a single process at once, except for “Partial heating method.”
H
Soldering conditions
Peak package’s surface temperature: 235 C
Reflow time: 30 seconds or less (at 210 C or more)
Maximum allowable number of reflow processes: 3
Peak package’s surface temperature: 215 C
Reflow time: 40 seconds or less (at 210 C or more)
Maximum allowable number of reflow processes: 3
Solder temperature: 260 C or less
Flow time: 10 seconds or less
Number of flow process: 1
Preheating temperature: 120 C max. (measured on the package
surface)
Terminal temperature: 300 C or less
Flow time: 3 seconds or less (for each side of device)
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 C
Reflow time: 30 seconds or less (at 210 C or more)
Maximum allowable number of reflow processes: 2
Exposure limit
Note
:
7 days (10 hours of pre-baking is required at
125 C afterward.)
<Cautions>
Non-heat resistant trays, such as magazine and taping trays, cannot
be baked before unpacking.
Peak package’s surface temperature: 215 C
Reflow time: 40 seconds or less (at 200 C or more)
Maximum allowable number of reflow processes: 2
Exposure limit
Note
:
7 days (10 hours of pre-baking is required at
125 C afterward.)
<Cautions>
Non-heat resistant trays, such as magazine and taping trays, cannot
be baked before unpacking.
Terminal temperature: 300 C or less
Flow time: 3 seconds or less (for each side of device)
Symbol
IR35-107-2
VP15-107-2
–
Soldering process
Infrared ray reflow
VPS
Partial heating method
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UPD784031GK-9EU-A 制造商:Renesas Electronics Corporation 功能描述:16BIT K4 ROMLESS - Bulk
UPD784031YGC-8BT 制造商:Renesas Electronics Corporation 功能描述:
UPD784031YGC-8BT-A 制造商:Renesas Electronics Corporation 功能描述:
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