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參數(shù)資料
| 型號： | UPD78218A |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| 中文描述： | 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存 |
| 文件頁數(shù)： | 59/66頁 |
| 文件大小： | 510K |
| 代理商： | UPD78218A |
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59
μ
PD78217A, 78218A
8.
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78217A/78218A should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
“Semiconductor Device Mounting
Technology Manual” (IEI-1207)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales represen-
tative.
Table 8-1 Surface Mounting Type Soldering Conditions
#
Soldering Method
Soldering Conditions
Infrared ray reflow
IR35-00-2
Package peak temperature: 235
°
C, Reflow time: 30 seconds or less (at 210
°
C or
higher), Maximum number of reflow processes: 2 times
<Cautions>
(1) After the first reflow process, cool the package down to room temperature , then
start the second reflow process.
(2) After the first reflow process, do not use water to remove residual flux.
Package peak temperature: 215
°
C, Reflow time: 40 seconds or less (at 200
°
C or
higher), Maximum number of reflow processes: 2 times
<Cautions>
(1) After the first reflow process, cool the package down to room temperature , then
start the second reflow process.
(2) After the first reflow process, do not use water to remove residual flux.
Pin temperature: 300
°
C or below, Heat time: 3 seconds or less (per each side of
the device)
VPS
Partial heating
VP15-00-2
–––
Caution
Apply only one kind of soldering method to a device, except for partial heating method.
μ
PD78217AGC-AB8/78218AGC-
×××
-AB8 : 64-pin plastic QFP (14 x 14 mm)
Symbol
Table 8-2 Insertion Type Soldering Conditions
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less
Pin temperature: 300
°
C or below, Heat time: 3 seconds or less (per pin)
Partial heating
Caution
The wave soldering process must be applied only to pins, and make sure that the package body does
not get jet soldered.
Soldering Method
Soldering Conditions
Wave soldering
(pin only)
μ
PD78217ACW/78218ACW-
×××
: 64-pin plastic shrink DIP (750 mil)
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