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參數(shù)資料
| 型號(hào)： | UPD780032AY |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 8位單晶片微控制器 |
| 文件頁(yè)數(shù)： | 61/70頁(yè) |
| 文件大?。?/td> | 527K |
| 代理商： | UPD780032AY |
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61
μ
PD780031AY, 780032AY, 780033AY, 780034AY
Data Sheet U14045EJ1V0DS00
(2)
μ
PD780031AYGK-
×××
-8A8: 64-pin plastic LQFP (12
×
12 mm)
μ
PD780032AYGK-
×××
-8A8: 64-pin plastic LQFP (12
×
12 mm)
μ
PD780033AYGK-
×××
-8A8: 64-pin plastic LQFP (12
×
12 mm)
μ
PD780034AYGK-
×××
-8A8: 64-pin plastic LQFP (12
×
12 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
(at 210
°
C or higher),
Count: two times or less,
Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
(at 200
°
C or higher),
Count: two times or less,
Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 10 hours)
VP15-107-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
Count: once, Preheating temperature: 120
°
C max. (package
surface temperature), Exposure limit: 7 days
Note
(after that, prebake
at 125
°
C for 10 hours
)
WS60-107-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
––
Note
After opening the dry pack, store it at 25
°
C or less and 65%RH or less for the allowable storage
period.
Caution Do not use different soldering methods together (except for partial heating).
Table 14-2. Insertion Type Soldering Conditions
μ
PD780031AYCW-
×××
: 64-pin plastic shrink DIP (750mils)
μ
PD780032AYCW-
×××
: 64-pin plastic shrink DIP (750mils)
μ
PD780033AYCW-
×××
: 64-pin plastic shrink DIP (750mils)
μ
PD780034AYCW-
×××
: 64-pin plastic shrink DIP (750mils)
Soldering Method
Soldering Conditions
Wave soldering
(only for pins)
Solder bath temperature: 260
°
C max., Time: 10 seconds max.
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD780032AYCW | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780032AYGC | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780032AYGK | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780033AY | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780033AYCW | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD780033AGK-B03-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780033AGK-B03-9ET-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780034AGC-119-8BS-A | 制造商:Renesas Electronics Corporation 功能描述:NECUPD780034AGC-119-8BS-A MCU |
| UPD780053GC-055-8BT-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780101MC-047-5A4-E1-A | 制造商:Renesas Electronics Corporation 功能描述: |
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