參數(shù)資料
型號: UPD5710TK
廠商: NEC Corp.
英文描述: 2-WIRE FACTORY PROGRAMMED W/TIN PLATING
中文描述: 鄰舍寬頻帶單控制CMOS SPDT開關
文件頁數(shù): 9/9頁
文件大?。?/td> 452K
代理商: UPD5710TK
UPD5710TK
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales of
fi
ce.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Re
fl
ow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220
°
C or higher
Preheating time at 120 to 180
°
C
Maximum number of re
fl
ow processes
Maximum chlorine content of rosin
fl
ux (% mass)
: 260
°
C or below
: 10 seconds or less
: 60 seconds or less
: 120
±
30 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
Time at temperature of 200
°
C or higher
Preheating time at 120 to 150
°
C
Maximum number of re
fl
ow processes
Maximum chlorine content of rosin
fl
ux (% mass)
: 215
°
C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120
°
C or below
Maximum number of
fl
ow processes
Maximum chlorine content of rosin
fl
ux (% mass)
: 260
°
C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin
fl
ux (% mass)
: 350
°
C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution
Do not use different soldering methods together (except for partial heating).
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
07/29/2004
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