參數(shù)資料
型號: UPD4218165L
廠商: NEC Corp.
英文描述: 3.3 V OPERATION 16 M-BIT DYNAMIC RAM 1 M-WORD BY 16-BIT, EDO, BYTE READ/WRITE MODE
中文描述: 3.3 V工作16 m位動態(tài)隨機(jī)存儲器1個M字由16位,江戶,字節(jié)讀/寫模式
文件頁數(shù): 45/48頁
文件大?。?/td> 319K
代理商: UPD4218165L
PD42S18165L, 4218165L
45
PD42S18165LLE, 4218165LLE: 42-pin plastic SOJ (400 mil)
μ
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak temperature of package surface: 235
°
C or lower,
Reflow time: 30 seconds or less (210
°
C or higher),
Number of reflow processes: MAX. 3
Exposure limit: 7 days
Note
(20 hours pre-baking is required at 125
°
C afterwards)
IR35-207-3
VPS
Peak temperature of package: 215
°
C or lower,
Reflow time: 40 seconds or less (200
°
C or higher),
Number of reflow processes: MAX. 3
Exposure limit: 7 days
Note
(20 hours pre-baking is required at 125
°
C afterwards)
VP15-207-3
Partial heating method
Terminal temperature: 300
°
C or lower,
Time: 3 seconds or less (Per side of the package).
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Caution
Do not apply more than one soldering method at any one time, except for “Partial heating
method”.
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