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參數(shù)資料
| 型號： | UPD16901 |
| 廠商： | NEC Corp. |
| 英文描述： | FLASH MEMORY VOLTAGE STEPUP DC/DC CONVERTER IC |
| 中文描述： | 快閃記憶體電壓句中的DC / DC轉(zhuǎn)換器集成電路 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 57K |
| 代理商： | UPD16901 |
9
μ
PD16901
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For soldering methods and conditions other than those recommended, please contact your NEC sales representative.
For details of recommended soldering conditions, refer to the information document
"Semiconductor Device
Mounting Technology Manual."
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235 C; Duration: 30 sec. max. (210 C or above):
Number of times: Max. 3; Time limit: None
Note
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)
is recommended.
IR35-00-3
VPS
Package peak temperature: 215 C; Duration: 40 sec. max. (200 C or above):
Number of times: 1; Time limit: None
Note
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)
is recommended.
VP15-00-1
Wave soldering
Package peak temperature: 260 C or less, Duration: 10 sec. max.,
Preparatory heating temperature: 120 C or less; Number of times: 1
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)
is recommended.
WS60-00-1
Note
For the storage period after unpacking from the dry-pack, storage conditions are max. 25 C, 65% RH.
Caution Use of more than one soldering method should be avoided.
REFERENCE DOCUMENTS
NEC Semiconductor Device Reliability/Quality Control System
Semiconductor Device Quality Guarantee Guide
Semiconductor Device Mounting Technology Manual
10983E
MEI-1202
C10535E
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