參數(shù)資料
型號: UPD16804GS
廠商: NEC Corp.
英文描述: MONOLITHIC H BRIDGE DRIVER CIRCUIT
中文描述: 單片電路H橋驅(qū)動電路
文件頁數(shù): 9/12頁
文件大小: 87K
代理商: UPD16804GS
μ
PD16804
9
RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the conditions described below.
For soldering methods and conditions other than those listed below, consult NEC.
Surface mount type
For the details of the recommended soldering conditions of this type, refer to
Semiconductor Device Mounting
Technology Manual (C10535E)
.
μ
PD16804GS
Symbol of
Recommended
Soldering
Soldering Method
Soldering Conditions
Infrared reflow
Peak package temperature: 235
°
C, Time: 30 seconds MAX. (210
°
C MIN.),
Number of times: 2 MAX.
IR35-00-2
VPS
Peak package temperature: 215
°
C, Time: 40 seconds MAX. (200
°
C MIN.),
Number of times: 2 MAX.
VP15-00-2
Wave soldering
Soldering bath temperature: 260
°
C Time: 10 seconds MAX.,
Preheating temperature: 120
°
C MAX. (package surface temperature),
Number of times: 1
WS60-00-1
Note
The number of storage days at 25
°
C, 65% RH after the dry pack has been opened
Caution Do not use two or more soldering methods in combination (except pin partial heating).
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