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參數(shù)資料
| 型號： | UPD16707 |
| 廠商： | NEC Corp. |
| 英文描述： | MOS INTEGRATED CIRCUIT |
| 中文描述： | 馬鞍山集成電路 |
| 文件頁數(shù)： | 19/21頁 |
| 文件大?。?/td> | 123K |
| 代理商： | UPD16707 |
Data Sheet S16411EJ1V0DS
19
μ
PD16707
7. RECOMMENDED MOUNTING CONDITIONS
The
μ
PD16707 should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Recommended Soldering Conditions for Surface Mounting Soldering Conditions.
μ
PD16707N-xxx: TCP (TAB Package)
Mounting Condition
Mounting Method
Condition
Thermocompression
Soldering
Heating tool 300 to 350
°
C, heating for 2 to 3 seconds : pressure 100g
(per solder)
ACF
(Adhesive
Conductive Film)
Temporary bonding 70 to 100
°
C: pressure 3 to 8 kg/cm
2
: time 3 to 5 sec.
Real bonding 165 to 180
°
C: pressure 25 to 45 kg/cm
2
: time 30 to 40 sec.
(When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite,Ltd).
Caution
To find out the detailed conditions for mounting the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more mounting methods at a time.
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