參數(shù)資料
型號(hào): UPD16641N-XXX
廠商: NEC Corp.
英文描述: Interface IC
中文描述: 接口IC
文件頁(yè)數(shù): 17/20頁(yè)
文件大?。?/td> 151K
代理商: UPD16641N-XXX
17
μ
PD16641
10. RECOMMENDED MOUNTING CONDITIONS
Mounting this product under the following conditions is recommended.
For the mounting methods and conditions other than those recommended, consult NEC.
Mounting Conditions
Mounting Method
Conditions
Soldering
Heating tool: 300 to 350°C, Heating time: 2 to 3 seconds,
Pressure: 100 g (per product)
Thermocompression bonding
ACF (sheet adhesive)
Preliminary adhesion: 70 to 100°C, Pressure: 3 to 8 kg/cm
Time: 3 to 5 seconds
Real adhesion: 165 to 180°C, Pressure: 25 to 45 kg/cm
40 seconds (when SUMIZAC1003 of Sumitomo Bakelite is used)
2
,
2
, Time 30 to
Note
For the mounting conditions for ACF, consult the ACF manufacturer.
Do not use two or more mounting methods in combination.
Reference
NEC Semiconductor Device Reliability/Quality Control System (C10983E)
Quality Grades to NEC’s Semiconductor Devices (C11531E)
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