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參數(shù)資料
| 型號： | UPD16311GC-AB6 |
| 廠商： | NEC Corp. |
| 英文描述： | 1/8- to 1/16-DUTY FIPTM VFD CONTROLLER/DRIVER |
| 中文描述： | 1/8-的1/16-DUTY FIPTM變頻控制器/驅動器 |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 167K |
| 代理商： | UPD16311GC-AB6 |
16
PD16311
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales
officers in case other soldering process is used or in case soldering is done under different conditions.
PD16311GC-AB6
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 2, Exposure limit*: None
IR35-00-2
VPS
Peak package’s surface temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 2, Exposure limit*: None
VP15-00-2
Wave soldering
Solder temperature: 260 C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit*: None
WS60-00-1
Partial heating method
Terminal temperature: 300 C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
*
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 C and relative humidity at 65 % or less.
Note
Do not apply more than a single process at once, except for “Partial heating method”.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD16311GC-AB6(A) | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD16312 | 制造商:NEC 制造商全稱:NEC 功能描述:1/4- to 1/11-DUTY FIPTM VFD CONTROLLER/DRIVER |
| UPD16312GB-3B4 | 制造商:NEC 制造商全稱:NEC 功能描述:1/4- to 1/11-DUTY FIPTM VFD CONTROLLER/DRIVER |
| UPD16312GBM | 制造商: 功能描述: 制造商:undefined 功能描述: |
| UPD16314 | 制造商:NEC 制造商全稱:NEC 功能描述:DOT CHARACTER VFD CONTROLLER/DRIVER |
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