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參數(shù)資料
| 型號： | UPC8158K-E1 |
| 廠商： | NEC Corp. |
| 英文描述： | RF UP-CONVERTER WITH AGC FUNCTION + IF QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS |
| 中文描述： | 射頻上變頻器帶AGC中頻正交調(diào)制器集成電路的數(shù)字移動通信系統(tǒng)的功能 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 126K |
| 代理商： | UPC8158K-E1 |
Preliminary Data Sheet P13831EJ1V1DS00
11
μ
PC8158K
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
μ
PC8158K
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared Reflow
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 2, Exposure limit
Note
: None
IR35-00-2
Partial Heating
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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