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參數(shù)資料
| 型號(hào)： | UPC3228T5S-E2-A |
| 廠商： | CEL |
| 文件頁(yè)數(shù)： | 4/12頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC DOWNCONVERTER LD 32-QFN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | 自動(dòng)增益控制放大器 |
| 應(yīng)用： | CATV |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-QFN（5x5） |
| 包裝： | 帶卷 (TR) |
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
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Infrared Reflow
Peak temperature (package surface temperature)
: 260°C or below
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Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°
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30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature)
: 260°C or below
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Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10623EJ01V0DS
12
μ
PC3228T5S
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