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參數(shù)資料
| 型號： | UPC1944T |
| 廠商： | NEC Corp. |
| 英文描述： | ADJUSTABLE PRECISION SHUNT REGULATORS |
| 中文描述： | 可調(diào)節(jié)精密并聯(lián)穩(wěn)壓器 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 77K |
| 代理商： | UPC1944T |
Data Sheet G10239EJ3V0DS00
9
μ
PC1943,1944
RECOMMENDED SOLDERING CONDITIONS
When soldering these products, there are highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
For more details, refer to our document
“Semiconductor Device Mounting Technology Manual” (C10535E)
.
Type of Surface Mount Device
μ
PC1943T, 1944T : Power mini mold (SOT-89)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°
C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°
C or higher),
Maximum number of reflow processes: 2 times.
IR35-00-2
VPS
Peak temperature: 215
°
C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°
C or higher),
Maximum number of reflow processes: 2 times.
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature).
WS60-00-1
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
μ
PC1944GR : 8-pin plastic SOP (5.72 mm (225))
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°
C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°
C or higher),
Maximum number of reflow processes: 1 time.
IR35-00-1
VPS
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°
C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature).
WS60-00-1
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
Type of Through-hole Device
μ
PC1944J : 3-pin plastic SIP (TO-92)
Process
Conditions
Wave soldering (only to leads)
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less.
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
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| UPC2708TB-E3 | 5 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPC1944T-AZ | 制造商:Renesas Electronics Corporation 功能描述:SEMICONDUCTOR, IC, VOLTAGE REGULATOR, PO |
| UPC1944T-E1-AZ | 制造商:Renesas Electronics Corporation 功能描述: |
| UPC1945 | 制造商:NEC 制造商全稱:NEC 功能描述:ADJUSTABLE PRECISION SHUNT REGULATORS |
| UPC1945TA | 制造商:NEC 制造商全稱:NEC 功能描述:ADJUSTABLE PRECISION SHUNT REGULATORS |
| UPC1945TA-E1 | 制造商:NEC 制造商全稱:NEC 功能描述:ADJUSTABLE PRECISION SHUNT REGULATORS |
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