參數(shù)資料
型號(hào)： UPC1876GT
廠商： NEC Corp.
英文描述： US MTS DECODER
中文描述： 美國(guó)的多邊貿(mào)易體制解碼器
文件頁(yè)數(shù)： 38/40頁(yè)
文件大?。?/td> 309K
代理商： UPC1876GT
μ
PC1876
38
Data Sheet S11666EJ4V0DS00
10. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 10-1. Surface Mounting Type Soldering Conditions
μ
PC1876GT: 42-pin plastic SSOP (9.53 mm (375))
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: 3 times max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: 3 times max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times: Once,
Preliminary heat temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per pin row)
—
Caution Do not use different soldering methods together (except in the case of partial heating).
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