參數(shù)資料
型號: UPC1857A
廠商: NEC Corp.
英文描述: CONN SEALING FOR WALL RCPT #24
中文描述: 聲控集成電路環(huán)繞和I2C總線
文件頁數(shù): 40/44頁
文件大?。?/td> 343K
代理商: UPC1857A
40
μ
PC1857A
8. RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the conditions described below.
For details of the recommended soldering conditions, refer to the
Semiconductor Device Mounting Technology
Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Soldering condition of through-hole type
μ
PC1857ACT: 30-pin plastic shrink DIP (400 mil)
Soldering Method
Soldering Condition
Wave soldering (only pins)
Soldering bath temperature: 260
°
C MAX., Time: 10 seconds
Partial heating
Pin temperature: 300
°
C MAX., Time: 3 seconds MAX. (per pin)
Caution Apply wave soldering only to the pins, and exercise care that solder does not directly contact the
package.
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