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參數(shù)資料
| 型號(hào)： | UPC1851B |
| 廠商： | NEC Corp. |
| 英文描述： | CONN SEALING FOR WALL RCPT #10 |
| 中文描述： | I2C總線兼容美國(guó)的多邊貿(mào)易體制處理LSI |
| 文件頁(yè)數(shù)： | 59/60頁(yè) |
| 文件大?。?/td> | 447K |
| 代理商： | UPC1851B |
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59
μ
PC1851B
Data Sheet S13417EJ2V0DS00
11. RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
to consult with our sales offices.
For more details, refer to our document
”Semiconductor Device Mounting Technology Manual” (C10535E).
μ
PC1851BCU: 42-pin plastic SDIP (15.24 mm (600))
Process
Conditions
Wave soldering (only to leads)
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or less
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (per each lead)
Caution The wave soldering process must be applied only to leads, and the make sure that
the package body does not get jet soldered.
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