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參數(shù)資料
| 型號： | UPC1652G |
| 廠商： | NEC Corp. |
| 英文描述： | SILICON MONOLITHIC BIPOLAR INTEGRATED CIRCUIT WIDE BAND AMPLIFIER |
| 中文描述： | 硅單片雙極集成電路寬帶放大器 |
| 文件頁數(shù)： | 4/8頁 |
| 文件大?。?/td> | 40K |
| 代理商： | UPC1652G |
Data Sheet P12443EJ5V0DS00
4
μ
PC1652G
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to keep minimum ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) The bypass capacitor should be attached to the V
CC
pin.
(5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
μ
PC1652G
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared ray reflow
Package peak temperature: 235 °C, Hour: within 30 s.
(more than 210 °C), Time: 3 times, Limited days: no.
Note
IR35-00-3
VPS
Package peak temperature: 215 °C, Hour: within 40 s.
(more than 200 °C), Time: 3 times, Limited days: no.
Note
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260 °C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Note
WS60-00-1
Pin part heating
Pin area temperature: less than 300 °C, Hour: within 3 s/pin.
Limited days: no.
Note
Note
It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Caution
The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICON-
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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