- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383976 > UPC1555 (NEC Corp.) TIMER CIRCUIT PDF資料下載
參數(shù)資料
| 型號： | UPC1555 |
| 廠商： | NEC Corp. |
| 英文描述： | TIMER CIRCUIT |
| 中文描述： | 定時器電路 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大小： | 103K |
| 代理商： | UPC1555 |
11
μ
PC1555
RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
μ
PC1555.
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Surface-Mount Devices
For details of the recommended soldering conditions, refer to our document SMD Surface Mount Technology
Manual (IEI-1207).
μ
PC1555G2
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25
°
C or less and maximum relative humidity of 65% or less
Caution Do not apply more than a single process at once, except for “Partial heating method.”
Through-Hole Mount Devices
μ
PC1555C
Soldering process
Soldering conditions
Symbol
Infrared reflow
Peak package’s surface temperature: 230
°
C
Reflow time: 30 seconds or less (at 210
°
C or more)
Maximum allowable number of reflow processes: 1
Exposure limit: None
Note
IR30-00
VPS
Peak package’s surface temperature: 215
°
C
Reflow time: 40 seconds or less (at 200
°
C or more)
Maximum allowable number of reflow processes: 1
Exposure limit: None
Note
VP15-00
Wave soldering
Temperature in the soldering vessel: 260
°
C or less
Soldering time: 10 seconds or less
Maximum allowable number of reflow processes: 1
Exposure limit: None
Note
WS60-00
Partial heating method
Pin temperature: 300
°
C or less
Flow time: 10 seconds or less
Exposure limit: None
Note
Soldering process
Soldering conditions
Wave soldering
Temperature in the soldering vessel: 260
°
C or less
Soldering time: 10 seconds or less
REFERENCE
Document name
Document No.
NEC Semiconductor Device Reliability/Quality Control System
IEI-1212
Quality Grade on NEC Semiconductor Devices
IEI-1209
Semiconductor Device Mounting Technology Manual
IEI-1207
Semiconductor Device Package Manual
IEI-1213
Guide to Quality Assurance for Semiconductor Devices
MEI-1202
Semiconductor Selection Guide
MF-1134
相關PDF資料 |
PDF描述 |
|---|---|
| UPC1555C | TIMER CIRCUIT |
| UPC1555G2 | TIMER CIRCUIT |
| UPC1652G | SILICON MONOLITHIC BIPOLAR INTEGRATED CIRCUIT WIDE BAND AMPLIFIER |
| UPC1654 | 1.0 GHz SILICON MMIC AMPLIFIER |
| UPC1656 | 850 MHz WIDE-BAND SILICON MMIC AMPLIFIER |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPC1555C | 制造商:NEC 制造商全稱:NEC 功能描述:TIMER CIRCUIT |
| UPC1555C-A | 制造商:Renesas Electronics 功能描述:Bulk |
| UPC1555G2 | 制造商:Renesas Electronics Corporation 功能描述:Semiconductor, Timer, SOP8,Vcc4.5to16V,I |
| UPC1555G2-A | 制造商:Renesas Electronics 功能描述:Cut Tape 制造商:Renesas 功能描述:Standard Timer Single 8-Pin SOP |
| UPC156 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。