參數(shù)資料
型號: UPB1512TU-E2-A
廠商: California Eastern Laboratories
英文描述: NECs 13 GHz INPUT DIVIDE BY 8 PRESCALER IN FOR SATELLITE COMMUNICATIONS
中文描述: 鄰舍13 GHz的輸入除以8預(yù)分頻器中的衛(wèi)星通信
文件頁數(shù): 9/10頁
文件大?。?/td> 552K
代理商: UPB1512TU-E2-A
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
01/17/05
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
UPB1512TU
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220
°
C or higher
Preheating time at 120 to 180
°
C
Maximum number of reflow processes
: 260
°
C or below
: 10 seconds or less
: 60 seconds or less
: 120
±
30 seconds
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature)
: 260
°
C or below
: 10 seconds or less
Time at peak temperature
Preheating temperature (package surface temperature) : 120
°
C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature)
: 350
°
C or below
: 3 seconds or less
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution
Do not use different soldering methods together (except for partial heating).
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
(3) Keep the track length of the ground terminals as short as possible.
(4) Bypass capacitance must be attached to V
CC
line.
(5) Exposed heat sink at bottom on package must be soldered to PCB RF/DC ground.
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