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參數(shù)資料
| 型號(hào)： | ULC0402FC15C |
| 英文描述： | Flash in-system programmable (ISP) peripherals for 8-bit MCUs, 3.3 V |
| 中文描述： | 直接太克替代：ULC0402FC15C |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 116K |
| 代理商： | ULC0402FC15C |
4
www.protekdevices.com
05152.R4 11/02
ULC0402FC3.3C
thru
ULC0402FC24C
COPYRIGHT ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without
notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final
judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance,
ProTek assumes no responsibility with respect to the selection or specifications of such products.
PACKAGE OUTLINE & DIMENSIONS
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
TAPE & REEL ORDERING INFORMATION:
Surface mount product is taped and reeled in accordance with EIA-481.
Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULC0402FC05C-T75-1).
Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULC0402FC05C-T710-2).
A
B
C
D
E
F
I
0.46 NOM
0.86 NOM
0.99 ± 0.0254
0.10 NOM
0.35 NOM
0.483 ± 0.0254
0.406 NOM
0.018 NOM
0.034 NOM
0.039 ± 0.001
0.004 NOM
0.014 NOM
0.019 ± 0.001
0.016 NOM
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002
”
).
3. Maximum chip size: 1.02 (0.040
”
) by 0.51(0.020
”
).
PACKAGE OUTLINE
U0402
MOUNTING PAD
TAPE & REEL ORIENTATION
NOTE:
1. Top view of tape. Metal contacts are face
down in tape package.
Single Die
0402
D
E
F
I
S
A
B
C
TOP
END
06020 Rev 3 - 11/02
Metalized Die Contacts
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
A
B
C
D
E
F
G
H
I
0.23
0.48
0.69
0.46
0.99
0.20
0.20
0.66
0.13
DIM Millimeters
Inches
PAD DIMENSIONS
NOTE:
Preferred:Using 0.1mm (0.004
”
)
stencil.
B
C
DIE
CONTACTS
A
H
D
I
SOLDER PRINT
DIAMETER 0.010” -
0.012”
F
G
DIE
E
S
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ULC0402FC24C | Flash In-System Programmable (ISP) Peripherals For 8-bit MCUs, 5V |
| ULC0402FC3.3C | Flash In-System Programmable (ISP) Peripherals For 8-bit MCUs, 5V |
| ULC0406FC05C | Flash In-System Programmable (ISP) Peripherals For 8-bit MCUs, 5V |
| ULC0406FC08C | Flash In-System Programmable (ISP) Peripherals For 8-bit MCUs, 5V |
| ULC0406FC12C | Flash In-System Programmable (ISP) Peripherals For 8-bit MCUs, 5V |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ULC0402FC24C | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Direct ProTek Replacement:ULC0402FC24C |
| ULC0402FC3.3C | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULC0402FC3.3C_11 | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:200W LOW CAPACITANCE unbumpe d flip chip tvs array |
| ULC0402FC33C | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULC0402FC36C | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
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