Half-Bridge Bipolar Switch
UC2950
TRUTH TABLE
Source Drive
Pin 2
Low
Low
High
High
Note: With no load, output voltage will be HIGH in the OFF
state.
Sink Drive
Pin 5
Low
High
Low
High
Output
Pin 4
Low
Off
High
High
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage Range, V
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V to 35V
Output Voltage Range, V
O
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -3.0V to V
C
+3V
Input Voltage Range, V
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +7.0V
Peak Output Current (100 ms, 10% DC) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
4.0A
Continuous Output Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
2.0A
Power Dissipation with Heat Sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15W
Power Dissipation in Free Air. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2W
Operating Temperature Range, T
A
. . . . . . . . . . . . . . . . . . . . . . . -20°C to +100°C
Storage Temperature Range, T
S
. . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
5-PIN TO-220 (TOP VIEW)
T Package
FEATURES
Source or Sink 4.0A
Supply Voltage to 35V
High-Current Output Diodes
Tri-State Operation
TTL and CMOS Input Compatibility
Thermal Shutdown Protection
300kHz Operation
Low-Cost TO-220 Package
DESCRIPTION
This device is a monolithic integrated circuit designed to provide high-cur-
rent switching with low saturation voltages when activated by low-level logic
signals. Source and sink switches may be independently activated without
regard to timing as a built-in interlock will keep the sink off if the source is
on.
This driver has the high current capability to drive large capacitive loads
with fast rise and fall times; but with high-speed internal flyback diodes, it is
also ideal for inductive loads. Two UC2950s can be used together to form
a full bridge, bipolar motor driver compatible with high frequency chopper
current control.
CONNECTION DIAGRAM
SIMPLIFIED SCHEMATIC
Note 1: Consult Packaging section of dat-
abook for thermal limitations and considera-
tions of package.
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