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參數(shù)資料
| 型號(hào)： | TXB0102YZPR |
| 廠商： | Texas Instruments |
| 文件頁(yè)數(shù)： | 8/20頁(yè) |
| 文件大小： | 0K |
| 描述： | IC VOLT TRANSLATOR 2BIT 8-DSBGA |
| 產(chǎn)品培訓(xùn)模塊： | Voltage Level Translation |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 邏輯功能： | 變換器，雙向 |
| 位數(shù)： | 2 |
| 輸入類型： | 邏輯 |
| 輸出類型： | 邏輯 |
| 數(shù)據(jù)速率： | 100Mbps |
| 通道數(shù)： | 2 |
| 輸出/通道數(shù)目： | 1 |
| 差分 - 輸入:輸出： | 無(wú)/無(wú) |
| 傳輸延遲（最大）： | 4ns |
| 電源電壓： | 1.2 V ~ 3.6 V，1.65 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 8-XFBGA，DSBGA |
| 供應(yīng)商設(shè)備封裝： | 8-DSBGA，8-WCSP（1.9x0.9） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁(yè)面： | 1039 (CN2011-ZH PDF) |
| 其它名稱： | 296-21961-6 |
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TXB0102DCUR
ACTIVE
US8
DCU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
(NFDQ ~ NFDR)
TXB0102DCURG4
ACTIVE
US8
DCU
8
3000
TBD
Call TI
-40 to 85
(NFDQ ~ NFDR)
TXB0102DCUT
ACTIVE
US8
DCU
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
(NFDQ ~ NFDR)
TXB0102DCUTG4
ACTIVE
US8
DCU
8
250
TBD
Call TI
-40 to 85
(NFDQ ~ NFDR)
TXB0102YZPR
ACTIVE
DSBGA
YZP
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
(2E ~ 2E2 ~ 2E7 ~
2EN)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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