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參數(shù)資料
| 型號： | TWL1107PWR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PDSO20 |
| 封裝： | PLASTIC, TSSOP-20 |
| 文件頁數(shù)： | 15/19頁 |
| 文件大?。?/td> | 259K |
| 代理商： | TWL1107PWR |
TWL1107
VOICE-BAND AUDIO PROCESSOR (VBAP
)
SLWS119 – JUNE 2001
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
recommended operating conditions (see Note 2)
MIN
NOM
MAX
UNIT
Supply voltage, DVDD, EARVDD
2.7
3.3
V
High-level input voltage, VIH
0.7 x VDD
V
Low-level input voltage, VIL
0.3 x VDD
V
Load impedance between EAROUT+ and EAROUT–, RL
8 to 32
Input voltage, MICIN
0.9 x VDD
V
Operating free-air temperature, TA
– 40
85
_C
NOTES:
1. To avoid possible damage and resulting reliability problems to these CMOS devices, follow the power-up sequence detailed in the
system reliability features paragraph.
2. Voltages are with respect to DVSS and EARVSS.
electrical characteristics over recommended ranges of supply voltage and operating free-air temperature
(unless otherwise noted)
supply current
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
I
Supply current from V
Operating
5
7
mA
IDD
Supply current from VDD
Power down, MCLK not present
10
30
A
tpu
Power-up time from power down
10
ms
digital interface
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VOH
High-level output voltage, PCMO
IOH = – 3.2 mA,
VDD = 3 V
DVDD – 0.25
V
VOL
Low-level output voltage, PCMO
IOL = 3.2 mA,
VDD = 3 V
0.2
V
IIH
High-level input current, any digital input
VI = 2.2 V to VDD
10
A
IIL
Low-level input current, any digital input
VI = 0 to 0.8 V
10
A
CI
Input capacitance
10
pF
Co
Output capacitance
20
pF
microphone interface
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIO
Input offset voltage
See Note 3
– 5
5
mV
IIB
Input bias current
– 250
250
nA
Ci
Input capacitance
5
pF
Vn
Microphone input referred noise, psophometric weighted
MIC Amp 1 gain = 23.5 dB,
See Note 4
2.9
4
Vrms
MICMUTE
– 80
dB
NOTES:
3. Measured while MICIN+ and MICIN– are connected together. Less than 0.5 mV offset results in 0 value code on PCMOUT.
4. Configured as shown in Figure 3.
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