參數(shù)資料
型號: TSS461CVAN
英文描述: Van Controller Serial Interface
中文描述: 范控制器串行接口
文件頁數(shù): 14/24頁
文件大?。?/td> 215K
代理商: TSS461CVAN
Qualpack TS80C31X2/C32X2
14
Rev. 2 – January 1999
4.4 Package Qualification
This section presents TSS463 and TSS461C package qualification results, including additional
measurements intending to fulfil Q100 Automotive Standard requirements.
Lot
Number
Z21538F
Device Type
Test Description
Step
Result
Comment
TSS463
in SO 16 (1)
Thermal Cycles
1000c
2000c
1000h
2000h
Level 1
Level 3
168h
0/45
0/45
0/45
0/45
1/10
0/10
0/45
85/85 Humidity
Resistance to Soldeting
Heat
HAST after Soldering
Stress (with 5.5v bias)
Thermal Cycles
1 die top delamination
Z21997A
TSS463
in SO 16 (2)
500c
1000c
500h
1000h
168h
SAM
500h
1000h
Visual
0/45
0/45 (3)
0/45
0/45 (3)
0/45 (3)
0/10
0/45
0/45
0/5
85/85 Humidity
HAST after Soldering
Stress
165c HT Storage
Physical Dimensions
Bonding Destructive Tests
(4)
WP
BS
0/30 (5)
0/30
AVG=77.3 STD=8.9 CPK=1.8
MAX=98.9 MIN=61.1
AVG=17.4 STD=1.5 CPK=2.3
MAX=21.1 MIN=14.3
Resistance to Soldeting
Heat
Level 1
Level 2
Level 5
500c
1000c
500h
1000h
168h
0/10
0/10
0/10
0/45
0/45
0/45
0/45
0/45
W28184C
29C461B
in SO 24 (1)
Thermal Cycles
85/85 Humidity
HAST after Soldering
Stress
Thermal Cycles
Z04948C
TSS461C
500c
1000c
500h
1000h
168h
0/45
0/45
0/45
0/45
0/45
85/85 Humidity
HAST after Soldering
Stress
HAST 5.5V
168h
336h
0/45
0/45
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