
Qualpack TSS463 / TSS461C
Rev. 2 – January 1999
3
2. General Information
Product Name:
Function:
Specific features:
TSS463 / TSS461C
Van Controllers
Serial Interface (TSS463)
Wafer process:
Z86E
Available plastic package types:
SOIC16 (TSS463), SOIC24 (TSS461C)
Locations:
Process, product development
Wafer plant
QC responsability
Assembly
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
ANAM, Korea, Philippines
Probe test
Final test
TEMIC Semiconductors Nantes, France
GATEWAY Philippines
ANAM Korea
Quality Assurance
Reliability testing
Failure analysis
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
Quality Assurance Management Nantes
Signed..........................................................