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參數(shù)資料
| 型號(hào)： | TSL238D-TR |
| 廠商： | AMS-TAOS USA Inc |
| 文件頁數(shù)： | 9/13頁 |
| 文件大?。?/td> | 589K |
| 描述： | IC LIGHT TO FREQUENCY CONV 8SOIC |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | * |
| 其它名稱： | TSL238-D-TRDKR TSL238-D-TRDKR-ND |
TSL238
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS073J SEPTEMBER 2008
8
r
r
Copyright E 2008, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL DATA
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound having an index of refraction of 1.55.
PACKAGE D
PLASTIC SMALL-OUTLINE
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
455
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41
0.25
0.10
0.25
0.19
DETAIL A
PIN 1
6 y 1.27
0.510
0.330
8 y
j 2.8 TYP
CLEAR WINDOW
NOTE B
PIN 1
TOP VIEW
BOTTOM VIEW
SIDE VIEW
END VIEW
Lead Free
Pb
NOTES: A. All linear dimensions are in millimeters.
B. The center of the 0.84-mm by 0.84-mm photo-active area is located in the center of the package ?0.25 mm.
C. Pin 4 is resistively coupled to the substrate of the die, which is at the same potential as Pin 6. Pin 4 must either be connected to
Pin 6 or left unconnected. Pin 4 cannot be used as the sole ground connection.
D. Leads are plated with Pd (min 0.1 ?inch) + Ni (min 10 ?inch) + Au (min 0.1 ?inch).
E. This drawing is subject to change without notice.
Figure 9. Package D Plastic Small Outline IC Packaging Configuration
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