參數(shù)資料
型號(hào): TSL237T
廠商: AMS-TAOS USA Inc
文件頁數(shù): 7/13頁
文件大?。?/td> 621K
描述: IC LIGHT TO FREQUENCY CONV 4-TMB
標(biāo)準(zhǔn)包裝: 1
傳感器類型: 光轉(zhuǎn)頻率轉(zhuǎn)換器
輸出類型: 數(shù)字
其它名稱: TSL237-TDKR
TSL237T
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS055J  DECEMBER 2007
6
r
r
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
APPLICATION INFORMATION
Measuring the Frequency
The choice of interface and measurement technique depends on the desired resolution and data-acquisition
rate. For maximum data-acquisition rate, period-measurement techniques are used.
Period measurement requires the use of a fast reference clock with available resolution directly related to the
reference-clock rate. The technique is employed to measure rapidly varying light levels or to make a fast
measurement of a constant light source.
Maximum resolution and accuracy may be obtained using frequency-measurement, pulse-accumulation,
or integration techniques. Frequency measurements provide the added benefit of averaging out random- or
high-frequency variations (jitter) resulting from noise in the light signal. Resolution is limited mainly by available
counter registers and allowable measurement time. Frequency measurement is well suited for slowly varying
or constant light levels and for reading average light levels over short periods of time. Integration, the
accumulation of pulses over a very long period of time, can be used to measure exposure  the amount of light
present in an area over a given time period.
Output enable (OE
) places the output in a high-impedance state for multiple-unit sharing of a microcontroller
input line. When the OE
 line goes low, the device resynchronizes the output to an integration cycle. The rising
edge of the output signal (OUT) will occur exactly one period of the output frequency after OE
 goes low.
PCB Pad Layout
Suggested PCB pad layout guidelines for the T package are shown in Figure 10.
1.50
2.90
0.90
1.00
NOTES:  A.  All linear dimensions are in millimeters.
B.  This drawing is subject to change without notice.
Figure 10. Suggested T Package PCB Layout
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