參數(shù)資料
型號: TS4990IDT
廠商: STMICROELECTRONICS
元件分類: 音頻/視頻放大
英文描述: 1.2 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8
封裝: LEAD FREE, SOP-8
文件頁數(shù): 18/32頁
文件大小: 714K
代理商: TS4990IDT
TS4990
Package information
25/32
Figure 67.
Package mechanical data for 9-bump flip-chip package
Figure 68.
Daisy chain mechanical data
The daisy chain sample features two-by-two pin connections. The schematics in Figure 68
illustrate the way pins connect to each other. This sample is used to test continuity on your
board. Your PCB needs to be designed the opposite way, so that pins that are unconnected
in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting
an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested.
Die size: 1.60 x 1.60 mm ±30m
Die height (including bumps): 600m
Bump diameter: 315m ±50m
Bump diameter before reflow: 300m ±10m
Bump height: 250m ±40m
Die height: 350m ±20m
Pitch: 500m ±50m
Coplanarity: 50m max
* Back coating height: 100m ±10m
* Optional
1.60 mm
0.5mm
0.25mm
1.60 mm
0.5mm
0.25mm
600m
100m
600m
100m
A
C
B
1
2
3
1.6mm
A
C
B
1
2
3
1.6mm
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