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參數(shù)資料
| 型號(hào)： | TPS92002D |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | FLUORESCENT LIGHT CONTROLLER, 110 kHz SWITCHING FREQ-MAX, PDSO8 |
| 封裝： | GREEN, PLASTIC, MS-012AA, SOIC-8 |
| 文件頁(yè)數(shù)： | 12/19頁(yè) |
| 文件大小： | 917K |
| 代理商： | TPS92002D |
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SLUSA24A – FEBRUARY 2010 – REVISED NOVEMBER 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
RANGE
UNIT
VDD
19
Input voltage range
SS
-0.3 to REF + 0.3
V
RTC, RTD
-0.3 to REF + 0.3
IREF
-15
Continuous input current
mA
IVDD
25
Output current
IGD (tpw < 1 s and Duty Cycle < 10%)
-0.4 to 0.8
A
Operating junction temperature
TJ
55 to +150
°C
Storage temperature
Tstg
65 to +150
Lead temperature
Soldering, 10 s
+300
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages
are with respect to GND. Currents are positive into, negative out of the specified terminal.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNIT
VDD
Input voltage
21
V
IGD
Output sink current
0
A
TJ
Operating junction temperature
–40
105
°C
DISSIPATION RATINGS
qJA, THERMAL
qJB, THERMAL
TA = 25°C
TA = 85°C
TB = 85°C
IMPEDANCE
PACKAGE
POWER
JUNCTION-TO-AMBIENT,
JUNCTION-TO-BOARD,
RATING (mW)
NO AIRFLOW (°C/W)
SOIC-8 (D)
165(1)
55
606(2)
242(2)
730(2)(3)
MSOP-8 (DGK)
181(1)
62
552(2)
221(2)
664(3)(2)
(1)
Tested per JEDEC EIA/JESD51-1. Thermal resistance is a function of board construction and layout. Air flow will reduce thermal
resistance. This number is included only as a general guideline; see TI document SPRA953 IC Package Thermal Metrics.
(2)
Maximum junction temperature TJ, equal to 125°C.
(3)
Thermal resistance to the circuit board is lower. Measured with standard single-sided PCB construction. Board temperature, TB,
measured approximately 1 cm from the lead to board interface. This number is provided only as a general guideline.
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
MIN
MAX
UNIT
Human body model
2000
V
CDM
1500
2
Copyright 2010, Texas Instruments Incorporated
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