- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382682 > TPS75615KTTR (Texas Instruments, Inc.) FAST-TRANSIENT RESPONSE 5-A LOW-DROPOUT VOLTAGE REGULATORS PDF資料下載
參數(shù)資料
| 型號(hào)： | TPS75615KTTR |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | FAST-TRANSIENT RESPONSE 5-A LOW-DROPOUT VOLTAGE REGULATORS |
| 中文描述： | 快速瞬態(tài)響應(yīng)5 -低壓差電壓調(diào)節(jié)器 |
| 文件頁(yè)數(shù)： | 13/24頁(yè) |
| 文件大?。?/td> | 450K |
| 代理商： | TPS75615KTTR |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)當(dāng)前第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)
www.ti.com
TJ
TA
P
D
max x R
θ
JC
R
θ
CS
R
θ
SA
(2)
TJ
TA
P
D
max x R
θ
JA
(3)
R
θ
JA
T
J
–T
A
P
D
max
(4)
TO-220 Power Dissipation
The TO-220 package provides an effective means of managing power dissipation in through-hole applications.
The TO-220 package dimensions are provided in the
Mechanical Data
section at the end of the data sheet. A
heatsink can be used with the TO-220 package to effectively lower the junction-to-ambient thermal resistance.
P
D
max
(3.3 – 2.5) V x 3 A
2.4 W
(5)
R
θ
JAmax
From Figure 22, R
Θ
JA
vs Heatsink Thermal Resistance, a heatsink with R
Θ
SA
= 22
°
C/W is required to dissipate
2.4 W. The model operating environment used in the computer model to construct Figure 22 consisted of a
standard JEDEC High-K board (2S2P) with a 1 oz. internal copper plane and ground plane. Since the package
pins were soldered to the board, 450 mm
2
of the board was modeled as a heatsink. Figure 23 shows the side
view of the operating environment used in the computer model.
(125 – 55)
°
C 2.4 W
29
°
C W
(6)
TPS75601, TPS75615
TPS75618, TPS75625
TPS75633
SLVS329C–JUNE 2001–REVISED MARCH 2004
THERMAL INFORMATION (continued)
Equation 2 summarizes the computation:
The R
Θ
JC
is specific to each regulator as determined by its package, lead frame, and die size provided in the
regulator's data sheet. The R
Θ
SA
is a function of the type and size of heatsink. For example,
black body radiator
type heatsinks, like the one attached to the TO-220 package in Figure 21(a), can have R
Θ
CS
values ranging from
5
°
C/W for very large heatsinks to 50
°
C/W for very small heatsinks. The R
Θ
CS
is a function of how the package is
attached to the heatsink. For example, if a thermal compound is used to attach a heatsink to a TO-220 package,
R
Θ
CS
of 1
°
C/W is reasonable.
Even if no external
black body radiator
type heatsink is attached to the package, the board on which the
regulator is mounted will provide some heatsinking through the pin solder connections. Some packages, like the
TO-263 and TI's TSSOP PowerPAD packages, use a copper plane underneath the package or the circuit
board's ground plane for additional heatsinking to improve their thermal performance. Computer aided thermal
modeling can be used to compute very accurate approximations of an integrated circuit's thermal performance in
different operating environments (e.g., different types of circuit boards, different types and sizes of heatsinks,
different air flows, etc.). Using these models, the three thermal resistances can be combined into one thermal
resistance between junction and ambient (R
Θ
JA
). This R
Θ
JA
is valid only for the specific operating environment
used in the computer model.
Equation 2 simplifies into Equation 3:
Rearranging Equation 3 gives Equation 4:
Using Equation 3 and the computer model generated curves shown in Figure 22 and Figure 25, a designer can
quickly compute the required heatsink thermal resistance/board area for a given ambient temperature, power
dissipation, and operating environment.
To illustrate, the TPS75625 in a TO-220 package was chosen. For this example, the average input voltage is 3.3
V, the average output voltage is 2.5 V, the average output current is 3 A, the ambient temperature 55
°
C, the air
flow is 150 LFM, and the operating environment is the same as documented below. Neglecting the quiescent
current, the maximum average power is:
Substituting T
J
max for T
J
into Equation 4 gives Equation 6:
13
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TPS75625KTTR | FAST-TRANSIENT RESPONSE 5-A LOW-DROPOUT VOLTAGE REGULATORS |
| TPS76030DBV | SWTCH LEVER SPDT 15A SOLD TERM |
| TPS76032DBV | LOW-POWER 50-mA LOW-DROPOUT LINEAR REGULATORS |
| TPS76033DBV | LOW-POWER 50-mA LOW-DROPOUT LINEAR REGULATORS |
| TPS76038DBV | LOW-POWER 50-mA LOW-DROPOUT LINEAR REGULATORS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPS75615KTTRG3 | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.5-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75615KTTT | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.5-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75615KTTTG3 | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.5-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75618KC | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.8-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75618KCG3 | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.8-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。