參數(shù)資料
型號： TPS728XX
廠商： Texas Instruments, Inc.
英文描述： 200mA Low-Dropout Linear Regulator with Pin-Selectable Dual-Voltage Level Output
中文描述： 200mA低與品差線性穩(wěn)壓器可選雙電壓電平輸出
文件頁數(shù)： 15/22頁
文件大?。?/td> 763K
代理商： TPS728XX
www.ti.com
THERMAL INFORMATION
Thermal Protection
Power Dissipation
P = (V
V
)
I
-
′
IN
OUT
OUT
(1)
Package Mounting
N TES:
O
1. All linear dimen
2. This drawing is sub
1,395
1,345
eters.
sions are in millim
ject to change with
out notice.
1,025
0,975
TPS728xx Series
SBVS095–AUGUST 2007
It was not intended to replace proper heatsinking.
Continuously running the TPS728xx into thermal
shutdown degrades device reliability.
Thermal protection disables the output when the
junction temperature rises to approximately +160
°
C,
allowing the device to cool. When the junction
temperature cools to approximately +140
°
C the
output circuitry is again enabled. Depending on power
dissipation,
thermal
resistance,
temperature, the thermal protection circuit may cycle
on and off. This cycling limits the dissipation of the
regulator, protecting it from damage as a result of
overheating.
The ability to remove heat from the die is different for
each
package
type,
considerations in the printed circuit board (PCB)
layout. The PCB area around the device that is free
of other components moves the heat from the device
to the ambient air. Performance data for JEDEC low-
and high-K boards are given in the
Dissipation
Ratings
table. Using heavier copper increases the
effectiveness in removing heat from the device. The
addition of plated through-holes to heat-dissipating
layers also improves the heatsink effectiveness.
presenting
different
and
ambient
Any tendency to activate the thermal protection circuit
indicates
excessive
power
inadequate heatsink. For reliable operation, junction
temperature should be limited to +125
°
C maximum.
To estimate the margin of safety in a complete design
(including
heatsink),
increase
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+35
°
C
above
the
maximum
condition
of
your
particular
configuration
produces
temperature of +125
°
C at the highest expected
ambient temperature and worst-case load.
dissipation
or
an
Power dissipation depends on input voltage and load
conditions. Power dissipation (P
D
) is equal to the
product of the output current times the voltage drop
across the output pass element (V
IN
to V
OUT
), as
shown in
Equation 1
:
the
ambient
expected
application.
worst-case
ambient
This
junction
a
Solder
TPS728xx are available from the Texas Instruments
web site at
www.ti.com
.
pad
footprint
recommendations
for
the
The internal protection circuitry of the TPS728xx has
been designed to protect against overload conditions.
Figure 42. YZU Wafer Chip-Scale Package Dimensions (in mm)
Copyright 2007, Texas Instruments Incorporated
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