SLVS965
– MARCH 2011
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
PACKAGE
PART
OUTPUT
DEVICE
TA
ORDERING(3)
MARKING
NUMBER
VOLTAGE(2)
SPECIFIC FEATURE
CHIP CODE
TPS62690
2.85V
500mA peak output current
TPS62690YFF
PB
-40
°C to 85°C
TPS62691(4)
2.2V
600mA peak output current
TPS62691YFF
SU
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
(2)
Internal tap points are available to facilitate output voltages in 25mV increments.
(3)
The YFF package is available in tape and reel. Add a R suffix (e.g. TPS62690YFFR) to order quantities of 3000 parts. Add a T suffix
(e.g. TPS62690YFFT) to order quantities of 250 parts.
(4)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Voltage at VIN(2)(3), SW(3)
–0.3
6
V
Input Voltage
Voltage at FB(3)
–0.3
3.6
V
Voltage at EN, MODE (3)
–0.3
VI + 0.3
V
TPS62690
500
mA
Peak output current, IO
TPS62691
600
mA
Power dissipation
Internally limited
Operating temperature range, TA
(4)
–40
85
°C
Operating junction temperature, TJ
150
°C
Storage temperature range, Tstg
–65
150
°C
Human body model
2
kV
ESD(5)
Charge device model
1
kV
Machine model
200
V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Operation above 4.8V input voltage is not recommended over an extended period of time.
(3)
All voltage values are with respect to network ground terminal.
(4)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (
θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 105
°C.
(5)
The human body model is a 100-pF capacitor discharged through a 1.5-k
resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
THERMAL INFORMATION
TPS62690
THERMAL METRIC(1)
UNITS
YFF (6 PINS)
θJA
Junction-to-ambient thermal resistance
121
θJCtop
Junction-to-case (top) thermal resistance
65
θJB
Junction-to-board thermal resistance
105
°C/W
ψJT
Junction-to-top characterization parameter
23
ψJB
Junction-to-board characterization parameter
95
θJCbot
Junction-to-case (bottom) thermal resistance
-
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report,
SPRA953.2
2011, Texas Instruments Incorporated