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參數(shù)資料
| 型號： | TPS62601YFFT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 1.1 A SWITCHING REGULATOR, 6600 kHz SWITCHING FREQ-MAX, BGA6 |
| 封裝： | GREEN, DSBGA-6 |
| 文件頁數(shù)： | 10/24頁 |
| 文件大小： | 785K |
| 代理商： | TPS62601YFFT |
THERMAL INFORMATION
J(MAX)
A
D(MAX)
JA
T
- T
125 C - 85 C
P
=
= 320mW
R
125 C/W
q
°
(3)
PACKAGE SUMMARY
YMSCC
LLLL
A1
B1
C1
A2
B2
D
E
C2
CHIP SCALE PACKAGE DIMENSIONS
SLVS678 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the
power-dissipation limits of a given component
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6260x devices is 125°C. The thermal
resistance of the 6-pin CSP package (YFF-6) is RθJA = 125°C/W. Regulator operation is specified to a maximum
ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 320 mW.
CHIP SCALE PACKAGE
(BOTTOM VIEW)
(TOP VIEW)
Code:
YM — Year Month date Code
S — Assembly site code
CC— Chip code
LLLL — Lot trace code
The TPS6260x device is available in an 6-bump chip scale package (YFF, NanoFree). The package
dimensions are given as:
D = 1.290 ±0.05 mm
E = 0.916 ±0.05 mm
18
Copyright 2008, Texas Instruments Incorporated
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